公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO | Journal of Electronic Materials | 61 | 58 | |
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; C. ROBERT KAO | Journal of Materials Research | |||
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | |||
1980 | Synergistic effect of irradiation and chemicals on the control of onion and potato post-harvest decay | 吳文希; Wu, Cathy H.H.; Fu, Y.K.; Tsai C.M.; Wu, Wen-Shi | International Symposium on Recent Advance in Food Science and Technology |