公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials |