| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 1996 | Detection and sequence analysis of a new herpesvirus-like agent in AIDS and non-AIDS Kaposi's sarcoma in Taiwan. | Su I.J.; Huang L.M.; Wu S.J.; Jin Y.T.; Kao Y.F.; TSEN-FANG TSAI ; Lee J.Y.; Hsu Y.H.; Hsiao C.H.; Chang Y.C.; Wang Y.W.; Lee C.Y. | Journal of the Formosan Medical Association = Taiwan yi zhi | 10 | ||
| 2009 | Development of lead-free solders with superior drop test reliability performance | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | 3 | 0 | |
| 2019 | Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints | Yang T.H.; Yu H.Y.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 9 | |
| 2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 139 | 125 | |
| 2007 | The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | 5 | 0 | |
| 2009 | Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids | Wang Y.W.; Kao C.R.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | 0 | 0 | |
| 2010 | Effects of Ni additions on the growth of Cu 3Sn in high-lead solders | Wang Y.W.; Chang C.C.; Chen W.M.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 6 | |
| 2010 | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | Chang C.C.; Lin Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 77 | 70 | |
| 2010 | Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems | Tsai M.Y.; Yang S.C.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 22 | 23 | |
| 2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 42 | 0 | |
| 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 42 | 34 | |
| 2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 12 | 15 | |
| 2010 | Interfacial reaction between 95Pb-5Sn solder bump and 37Pb-63Sn presolder in flip-chip solder joints | Chang C.C.; Wang Y.W.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 8 | 7 | |
| 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 74 | 69 | |
| 2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; Kao C.R.; C. ROBERT KAO | Journal of the Electrochemical Society | 4 | 4 | |
| 2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 2 | 3 | |
| 2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 80 | 73 | |
| 2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | 2 | 0 | |
| 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 4 | 5 | |
| 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 5 | 5 |
