| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 74 | 69 | |
| 2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; Kao C.R.; C. ROBERT KAO | Journal of the Electrochemical Society | 4 | 3 | |
| 2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 2 | 3 | |
| 2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 80 | 73 | |
| 2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | 2 | 0 | |
| 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 4 | 5 | |
| 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 5 | 5 | |
| 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 3 | 3 |
