| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 4 | 5 | |
| 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 5 | 5 | |
| 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 3 | 3 |
