公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2009 | High voltage lateral 4H-SiC JFETs on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-C.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | Device Research Conference | | | |
2019 | A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique | Chan, C.-K.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 13 | |
2009 | Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses | Scogna, A.C.; Orlandi, A.; Ricchiuti, V.; Wu, T.-L.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 5 | 0 | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | 1 | 0 | |
2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | 7 | 0 | |
2008 | A low cost dual-CPW differential line for two-layer PCBs | Chi, C.-J.; Chih-Wei, T.; Hsieh, J.-S.; Ko, W.-C.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 0 | 0 | |
2019 | Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure | Liu, H.-W.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 | 1 | 0 | |
2019 | A mm-Wave low-loss transition from microstrip line to air-filled substrate integrated wavguide on printed circuit board technology | Ting, C.-W.; Chen, K.-C.; Chen, S.; Wu, T.-L.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 5 | 0 | |
2019 | Modeling of radiated emission caused by coaxial-to-microstrip transition | Li, P.-J.; Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 | 1 | 0 | |
2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | Yen, L.-H.; Huang, Y.-C.; Su, S.-H.; Fan, C.-Y.; Chu, F.-H.; Kuo, F.-Y.; Lu, H.-C.; Mao, S.-G.; Lin, K.-Y.; Yen, T.-C.; Wu, T.-L.; SHAU-GANG MAO | 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 | 2 | 0 | |
2002 | More analyses for the service performance of elevator group systems | Chang, K.-M.; Wu, T.-L.; TZONG-LIN WU | Systems Analysis Modelling Simulation | 0 | 0 | |
2011 | A new bandstop filter using artificial defected ground structures with compact size and low radiation | Hsu, Y.-H.; Tsai, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 1 | 0 | |
2019 | Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines | Lin, T.-Y.; Huang, Y.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 14 | 15 | |
2008 | A novel broadband common-mode filter for high-speed differential signals | Liu, W.-T.; Han, T.-W.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 5 | 0 | |
2020 | A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit | Li, P.-J.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 12 | |
2014 | A novel compact balun using a weakly coupled line with grounded resonator | Tsai, C.-H.; Chen, H.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 8 | 5 | |
2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | 22 | 0 | |
2005 | A novel ultraflattened dispersion photonic crystal fiber | Wu, T.-L.; Chao, C.-H.; TZONG-LIN WU | IEEE Photonics Technology Letters | 171 | 135 | |
2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | Asia and South Pacific Design Automation Conference, ASP-DAC | 0 | 0 | |
2019 | A power divider with controllable transmission zeros using lumped artificial transmission line | Chen, S.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 2 | 0 | |