公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2013 | Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications | Yu J.J.; Chung C.K.; Yang S.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
2016 | Enhanced Efficiency and Stability of Inverted Perovskite Solar Cells Using Highly Crystalline SnO2Nanocrystals as the Robust Electron-Transporting Layer | Zhu Z.; Bai Y.; Liu X.; Chueh C.-C.; Yang S.; Jen A.K.-Y.; CHU-CHEN CHUEH | Advanced Materials | 434 | ||
2018 | Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium | Yang C.A.; Yang S.; Liu X.; Nishikawa H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2011 | Evidence that γ-secretase-mediated notch signaling induces neuronal cell death via the nuclear factor-κB-Bcl-2-interacting mediator of cell death pathway in ischemic stroke | Arumugam T.V.; Cheng Y.-L.; Choi Y.; Choi Y.-H.; Yang S.; Yun Y.-K.; Park J.-S.; Yang D.K.; Thundyil J.; Gelderblom M.; Karamyan V.T.; SUNG-CHUN TANG ; Chan S.L.; Magnus T.; Sobey C.G.; Jo D.-G. | Molecular Pharmacology | 80 | 76 | |
2020 | Full-Region Sensorless BLDC Drive for Permanent Magnet Motor using Pulse Amplitude Modulation with DC Current Sensing | Huang C; Wu C; Yang S.; SHIH-CHIN YANG | IEEE Transactions on Industrial Electronics | |||
2010 | Generation and analysis of the thiazide-sensitive Na+-Cl- cotransporter (Ncc/Slc12a3) Ser707X knockin mouse as a model of Gitelman syndrome | Yang S.; Lo Y.; Yu I.; SHU-WHA LIN ; Chang T.; Hsu Y.; Chao T.; Sytwu H.; Uchida S.; Sasaki S.; Lin S. | Human Mutation | 55 | 50 | |
2017 | Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals | Yang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; C. ROBERT KAO | Journal of Electronic Materials | |||
2014 | Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer | Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO | Solar Energy Materials and Solar Cells | 31 | 31 | |
2012 | HD2 proteins interact with RPD3-type histone deacetylases | Luo M.; Wang Y.-Y.; Liu X.; Yang S.; Wu K. | Plant Signaling and Behavior | 30 | 0 | |
2016 | Histone Acetylation and Plant Development | Liu X.; Yang S.; CHUN-WEI YU ; Chen C.-Y.; KEQIANG W | Enzymes | 26 | 0 | |
2013 | HISTONE DEACETYLASE19 interacts with HSL1 and participates in the repression of seed maturation genes in Arabidopsis seedlings | Zhou Y.; Tan B.; Luo M.; Li Y.; Liu C.; Chen C.; CHUN-WEI YU ; Yang S.; Dong S.; Ruan J.; Yuan L.; Zhang Z.; Zhao L.; Li C.; Chen H.; Cui Y.; KEQIANG WU ; Huang S. | Plant Cell | 131 | 103 | |
2017 | HISTONE DEACETYLASE6 acts in concert with histone methyltransferases SUVH4, SUVH5, and SUVH6 to regulate transposon silencing | CHUN-WEI YU ; Tai R.; Wang S.-C.; Yang P.; Luo M.; Yang S.; Cheng K.; Wang W.-C.; YI-SHENG CHENG ; KEQIANG WU | Plant Cell | 52 | 49 | |
2014 | Histone Lysine Demethylases and Their Functions in Plants | Luo M.; Hung F.-Y.; Yang S.; Liu X.; Wu K. | Plant Molecular Biology Reporter | 36 | 31 | |
2015 | Identification and characterization of Histone deacetylases in Tomato (Solanum Lycopersicum) | Zhao L.; Lu J.; Zhang J.; Wu P.-Y.; Yang S.; Wu K. | Frontiers in Plant Science | 54 | 31 | |
2019 | Identification and expression analysis of Snf2 family proteins in tomato (Solanum lycopersicum) | Zhang D.; Gao S.; Yang P.; Yang J.; Yang S.; Wu K. | International Journal of Genomics | 10 | 7 | |
2013 | Involvement of histone modifications in plant abiotic stress responses | Yuan L.; Liu X.; Luo M.; Yang S.; Wu K. | Journal of Integrative Plant Biology | 117 | 101 | |
2019 | Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections | Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2015 | Low temperature bonding for high temperature applications by using SnBi solders | Yang T.L.; Wu J.Y.; Li C.C.; Yang S.; C. ROBERT KAO | Journal of Alloys and Compounds |