公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 73 | |
2015 | Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration | Yang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2013 | Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications | Yu J.J.; Chung C.K.; Yang S.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
2014 | Effects of silver addition on Cu-Sn microjoints for chip-stacking applications | Yang T.L.; Yu J.J.; Shih W.L.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 40 | 40 | |
2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO | Materials Letters | 15 | 14 | |
2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2014 | Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications | Yang T.L.; Shih W.L.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; C. ROBERT KAO | Journal of Materials Science | |||
2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 32 | 32 | |
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 |