公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO | Materials Letters | 15 | 14 | |
2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2014 | Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications | Yang T.L.; Shih W.L.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; C. ROBERT KAO | Journal of Materials Science | |||
2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 32 | 32 | |
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 |