公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; C. ROBERT KAO | Journal of Materials Science |