公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications | C.-K. Shen; S. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 19 | 16 | |
2015 | Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band | C.-K. Shen; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
2016 | Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands | C.-W. Lin; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 2 | 0 | |
2015 | Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology | C.-K. Shen; M.-H. Tsai; H.-N. Chen; C.-P. Jou; Sally Liu; F.-L. Hsueh; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 1 | 0 | |
2018 | An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression | P.-S. Wei; M.-H. Tsai; S.-K. Hsu; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 14 | 15 | |
2018 | A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression | M.-H. Tsai; S.-K. Hsu; C.-K. Shen; P.-S. Wei; C.-H. Chern; T.-L. Wu; TZONG-LIN WU | IEEE/MTT-S International Microwave Symposium | 3 | 0 | |
2014 | Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression | C.-K. Shen; T.-L. Wu; C.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 6 | 0 | |
2015 | Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression | C.-K. Shen; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 6 | |
2015 | Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands | W.-Y. Hsu; C.-K. Shen; T.-L. Wu; Ch.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium | 1 | 0 | |
2016 | Study of Frequency Offset Behavior for Artificial Magnetic Structure in Compact Mobile Device | C.-Y. Liu; C.-K. Shen; S.-Y. Chen; T.-L. Wu; J.-J. Chang; B.-C. Tseng; J. Yen; TZONG-LIN WU | IEEE International Symposium on Antennas and Propagation (APSURSI) | 0 | 0 |