公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | A novel embedded power plane with 10GHz stopband for simultaneous switching noise | C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 0 | ||
2012 | Bid-Proportional Auction for Resource Allocation in Capacity-constrained Clouds | C.-W. Tsai; Z. Tsai; ZSEHONG TSAI | The First International Workshop on inter-Clouds and Collective Intelligence (iCCI-2012) | 10 | 0 | |
2004 | Chip-level model of switching noise coupling on integrated system combining package and printed circuit board | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | |||
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | |||
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 |