公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique | Chun-Hsing Li; Yen-Lin Liu; and Chien-Nan Kuo; CHUN-HSING LI | IEEE Transactions on Microwave Theory and Techniques | 24 | 18 | |
2013 | A 147 GHz fully differential D-band amplifier design in 65 nm CMOS | Chun-Hsing Li; Chih-Wei Lai; and Chien-Nan Kuo; CHUN-HSING LI | Asia-Pacific Microwave Conference Proceedings, APMC | 19 | 0 | |
2012 | 16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS | Chun-Hsing Li; Chien-Nan Kuo; CHUN-HSING LI | 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2012 - Digest of Papers | 5 | 0 | |
2013 | A 210-GHz amplifier in 40-nm digital CMOS technology | Chun-Lin Ko; Chun-Hsing Li; Chien-Nan Kuo; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | IEEE Transactions on Microwave Theory and Techniques | 34 | 30 | |
2014 | A 340 GHz triple-push oscillator with differential output in 40 nm CMOS | Chun-Hsing Li; Chun-Lin Ko; Chien-Nan Kuo; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | IEEE Microwave and Wireless Components Letters | 20 | 28 | |
2018 | A 340-GHz 2×2 CMOS THz imaging array sensor with high-resistivity silicon superstrate | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | 6th Int. Sensors Science (I3S) | |||
2016 | A 340-GHz Heterodyne Receiver Front End in 40-nm CMOS for THz Biomedical Imaging Applications | Chun-Hsing Li; Chun-Lin Ko; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | IEEE Transactions on Terahertz Science and Technology | 55 | 51 | |
2017 | A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications | Te-Yen Chiu; Chun Wang; Wan-Ting Hsieh; Hsien-Jia Lin; Ta-Yeh Lin; Roger Liu; Da-Chiang Chang; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017 | 6 | 0 | |
2017 | A 340-GHz high-gain silicon dielectric resonator antenna for THz imaging applications | Te-Yen Chiu; Chun-Hsing Li; CHUN-HSING LI | The 28th VLSI/CAD Symposium | |||
2017 | 340-GHz Low-Cost and High-Gain On-Chip Higher Order Mode Dielectric Resonator Antenna for THz Applications | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | IEEE Transactions on Terahertz Science and Technology | 86 | 73 | |
2016 | 340-GHz signal source design with integrated on-chip bondwire antenna in 41-nm CMOS | Te-Yen Chiu; Chun-Lin Ko; Chun-Hsing Li; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | Proceedings of 2016 6th International Workshop on Computer Science and Engineering | 0 | 0 | |
2015 | A 37.5-mW 8-dBm-EIRP 15.5 °-HPBW 338-GHz terahertz transmitter using SoP heterogeneous system integration | Chun-Hsing Li; Tzu-Yuan Chao; Chih-Wei Lai; Wei-Cheng Chen; Chun-Lin Ko; Chien-Nan Kuo; Yu-Ting Cheng; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | IEEE Transactions on Microwave Theory and Techniques | 22 | 21 | |
2017 | A 7.1-mW K/K<inf>a</inf>-Band Mixer with Configurable Bondwire Resonators in 65-nm CMOS | Chun-Hsing Li; Chun-Lin Ko; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | 5 | 3 | |
2015 | A 8-mW 77-GHz band CMOS LNA by using reduced simultaneous noise and impedance matching technique | Chun-Lin Ko; Chun-Hsing Li; Chien-Nan Kuo; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | Proceedings - IEEE International Symposium on Circuits and Systems | 7 | 0 | |
2019 | A?X?/Ku-Band QFN-Packaged GaAs LNA Supporting Dual-Polarization Signal Reception | Chun Wang; Kuang-Yu Chen; Yu-Ling Lee; and Chun-Hsing Li; CHUN-HSING LI | 2019 IEEE Asia-Pacific Microwave Conference (APMC) | 3 | 0 | |
2018 | A Balunless Frequency Multiplier With Differential Output by Current Flow Manipulation | Chun-Hsing Li; Wei-Min Wu; CHUN-HSING LI | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | 5 | 12 | |
- | Broadband connection structure and method | Chun-Hsing Li; Chien-Nan Kuo; CHUN-HSING LI | ||||
2013 | A broadband interconnect for THz heterogeneous system integration | Chun-Hsing Li; Jan-Jr Wu; Chien-Nan Kuo; Yu-Ting Cheng; and Ming-Ching Kuo; CHUN-HSING LI | ||||
2007 | Broadband?flip-chip?interconnects?for millimeter-wave Si-carrier system-on-package | Chun-Hsing Li; Chang Tsung Fu; Tzu-Yuan Chao; Chien-Nan Kuo; Yu-Ting Cheng; and D.-C. Chang; CHUN-HSING LI | IEEE MTT-S International Microwave Symposium Digest | 4 | 0 | |
2014 | CMOS THz transmissive imaging system | Tzu-Chao Yan; Chun-Hsing Li; Chih-Wei Lai; Wei-Cheng Chen; Tzu-Yuan Chao; and Chien-Nan Kuo; CHUN-HSING LI | 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers | 4 | 0 |