公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2002 | Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals | Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2001 | Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals | Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H. | Materials Characterization | | | |
2002 | Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals | Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H. | Materials Characterization | | | |
2004 | Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 0 | |
2006 | Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes | Chuang, T. H.; Yen, S. F.; Cheng, M. D.; ChuangTH | Journal of Electronic Materials | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2000 | Precipitation parameterization in a simulated Mei-Yu front | Yang, M. J.; Chien, F. C.; Cheng, M. D.; MING-JEN YANG | Terrestrial Atmospheric and Oceanic Sciences | 18 | 18 | |
2002 | Soldering reactions between In49Sn and Ag thick films | Cheng, M. D.; Wang, S. S.; Chuang, T. H. | Journal of Electronic Materials | | | |