公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2011 | Design and implementation of 3D-thermal test chip for exploration of package effects | Chien, J.-H.; Lung, C.-L.; Lin, T.-W.; Tsai, K.-J.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 3 | 0 | |
2008 | Development of a Flexible Surface Wetness Sensor Using a RFID Technique | Yang, C. H.; Chien, J.-H.; Wang, B. Y.; Chen, Ping-Hei,; Lee, Da-Sheng | Biomedical Microdevices | | | |
2008 | Development of a Flexible Surface Wetness Sensor Using a RFID Technique | Yang, C. H.; Chien, J.-H.; Wang, B. Y.; Chen, Ping-Hei,; Lee, Da-Sheng; PING-HEI CHEN | Biomedical Microdevices | | | |
2008 | DNA detection using a radio frequency biosensor with gold nanoparticles | Chien, J.-H.; Yang, C.-H.; Chen, P.-H. ; Yang, C.-R.; Lin, C.-S.; HUEI WANG | Frontiers in Bioscience | 4 | 3 | |
2012 | Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures | Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
2011 | Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons | Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
2012 | Thermal stress aware design for stacking IC with through glass via | Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | | | |