公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 73 | |
2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2009 | Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate | Tsai M.H.; Lin Y.W.; Chuang H.Y.; C. ROBERT KAO | Journal of Materials Research | |||
2015 | EGCG inhibits proliferation, invasiveness and tumor growth by up-regulation of adhesion molecules, suppression of gelatinases activity, and induction of apoptosis in nasopharyngeal carcinoma cells | Fang C.-Y.; Wu C.-C.; Hsu H.-Y.; Chuang H.Y.; Huang S.-Y.; CHING-HWA TSAI ; Chang Y.; Tsao G.S.-W.; Chen C.-L.; Chen J.-Y. | International Journal of Molecular Sciences | 56 | 55 | |
2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
2010 | Oxidation behavior of ENIG and ENEPIG surface finish | Lee C.C.; Chuang H.Y.; Chung C.K.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 |