公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2013 | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | M. H.Liao ; G.-H. Liu; M.-Y. Yu; C.-H. Chen; C.-X. Hong | AIP Advances | 3 | 2 | |
2013 | Relaxation of Residual Stress in Bent GaN Film on Sapphire Substrate by Laser Treatment With an Optimized Surface Structure Design | M. H.Liao ; C. H. Chen; L.-C. Chang; S. C. Kao; M.-Y. Yu; G.-H. Liu; M.-C.Huang | IEEE Transaction on Electron Devices | 1 | ||
2013 | The relaxation of stress and reduction of KOZ by the special designed trench structure near the TSV for the application of 3-DICs | M. H.Liao ; M.-Y. Yu; G.-H. Liu; C.-H. Chen; C.-X. Hong | Asia-Pacific Radio Science Conference |