公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2003 | Chemical reaction in advanced microelectronic packages | Ho, C. E.; Lin, Y. L.; Tsai, J. Y.; Kao, and C. R. | Journal of the Chinese Institute of Chemical Engineers | | | |
2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. | Journal of Electronic Materials | | | |
2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R. | Journal of Electronic Materials | | | |
2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho, C. E.; Shiau, L. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho, C. E.; Chen, W. T.; Kao, and C. R. | Journal of Electronic Materials | | | |
2007 | Interfacial reaction issues for lead-free electronic solders | Ho, C. E.; Yang, S. C.; Kao, C. R. | Journal of Materials Science: Materials in Electronics | | | |
2007 | Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element | Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R. | Journal of Applied Physics 101: | | | |
2000 | Optimizing the wire-bonding parameters for second bond in ball grid array packages | Ho, C. E.; Chen, C.; Kao, and C. R. | Journal of the Chinese Institute of Engineers | | | |
1999 | Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering | Ho, C. E.; Chen, Y. M.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho, C. E.; Tsai, S. Y.; Kao, and C. R. | IEEE Transactions on Advanced Packaging | | | |