Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2008 | Microstructure study of high lead bump FCBGA bending test | Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference |