公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1991 | Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys | Yao, Y. D.; Chen, Y. Y.; Chuang, T. H.; Kung, C.; Lin, C. J. | J. Appl. Phys | | | |
1991 | Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys | Yao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG | Journal of Applied Physics | | | |
2019 | FloatSD: A New Weight Representation and Associated Update Method for Efficient Convolutional Neural Network Training | Lin, P.-C.; Sun, M.-K.; Kung, C.; Chiueh, T.-D.; TZI-DAR CHIUEH | IEEE Journal on Emerging and Selected Topics in Circuits and Systems | 11 | 10 | |
1994 | HyHOPE:a Fast Fault Simulator with Efficient Simulation of Hypertrophic Faults | Kung, C.; 林呈祥; Lin, Chen-Shang | International Conference on Computer Aided Design, San Jose, CA(1994.11) | | | |
1991 | Parallel Sequence Fault Simulation for Synchronous Sequential Circuits | Kung, C.; 林呈祥; Lin, Chen-Shang | VLSITSA, Taipei(1991.05) | | | |
1994 | Reducing Hypertrophic Fault Events in Sequential Fault Simulation | Kung, C.; 林呈祥; Lin, Chen-Shang | VLSI Design/CAD Symposium, Taipei(1994.08) | | | |
1992 | Test Reduction in Scan-Designed Circuits | Lai, W.; Kung, C.; 林呈祥; Lin, Chen-Shang | Proceedings of International Electronic Devices and Materials Symposium | | | |
1993 | Test Time Reduction in Scan Designed Circuits | Lai, W.; Kung, C.; 林呈祥; Lin, Chen-Shang | EDAC-EUROASIC | | | |