公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2022 | Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films | Lee P.-I; Wu P.-C; TUNG-HAN CHUANG | Journal of Electronic Materials | 2 | 0 | |
2020 | Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer | Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | |||
2021 | Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires | Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
2022 | Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment | Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | |||
2022 | Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes | Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | |||
2022 | Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire | Chen C.-H; Lee P.-I; TUNG-HAN CHUANG | Journal of Alloys and Compounds | 7 | 6 | |
2020 | An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages | Chuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | |||
2021 | Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices | Wu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics |