Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2012 | A point-wise fiber Bragg grating displacement sensing system and its application for active vibration suppression of a smart cantilever beam subjected to multiple impact loadings | Chuang, Kuo-Chih; Ma, Chien-Ching ; Liao, Heng-Tseng; Chuang, K.-C.; Ma, C.-C.; Liao, H.-T.; Chuang, Kuo-Chih; CHIEN-CHING MA ; Liao, Heng-Tseng | Smart Materials and Structures | 2 | 1 | |
2006 | A study on wafer thinning techniques with residual stress estimation | Young, H.-T.; Lin, C.-C.; Chang, M.-T.; Liao, H.-T.; HONG-TSU YOUNG | 6th International Conference European Society for Precision Engineering and Nanotechnology, 2006 | | | |
2011 | Dynamic sensing performance of a point-wise fiber bragg grating displacement measurement system integrated in an active structural control system | Chuang, K.-C.; Liao, H.-T.; Ma, C.-C.; Chuang, Kuo-Chih; Liao, Heng-Tseng; Ma, Chien-Ching ; Chuang, Kuo-Chih; CHIEN-CHING MA ; Liao, Heng-Tseng | Sensors | 7 | 5 | |
2020 | Influence of soil properties on the bioaccessibility of Cr and Ni in geologic serpentine and anthropogenically contaminated non-serpentine soils in Taiwan | Wang, Y.-L.; Tsou, M.-C.; Liao, H.-T.; Hseu, Z.-Y.; Dang, W.; Hsi, H.-C.; HSING-CHENG HSI ; ZENG-YEI HSEU | Science of the Total Environment | 23 | 21 | |
2007 | Novel method to investigate the critical depth of cut of ground silicon wafer | Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG | Journal of Materials Processing Technology | 44 | 37 | |
2008 | Precision wafer thinning and its surface conditioning technique | Young, H.-T.; Lin, C.-C.; Liao, H.-T.; Yang, M.; Young, H T.; Lin, C C.; Liao, H T.; Yang, M.; HONG-TSU YOUNG ; Young, H T.; Lin, C C.; Liao, H T.; LIN, YU-CHENG; CHANG, PI-FENG; HU, FU- CHANG; CHANG, MEI-HWEI; NI, YEN-HSUAN | International Journal of Materials and Product Technology | 3 | 2 | |
2019 | Seasonal variation of chemical characteristics of fine particulate matter at a high-elevation subtropical forest in East Asia | Lee, Celine S. L.; Chou, C. C.-K.; Cheung, H. C.; Tsai, C.-Y.; Huang, W.-R.; SHENG-HSIU HUANG ; Chen, M.-J.; Liao, H.-T.; CHANG-FU WU ; Tsao, T.-M.; MING-JER TSAI ; TA-CHEN SU | Environmental Pollution | 20 | 15 | |
2006 | Surface integrity of silicon wafers in ultra precision machining | Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG | International Journal of Advanced Manufacturing Technology | 64 | 47 | |