公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2007 | Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer | Young, H.T.; Liao, H.T. | Journal of Material Processing Technology | | | |
2005 | Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer | Young, H.T.; Liao, H.T. | Journal of Material Processing Technology | | | |
2007 | Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer | Young, H.T.; Liao, H.T.; HONG-TSU YOUNG | Journal of Material Processing Technology | | | |
2006 | Precision Wafer Thinning and Its Surface Conditioning Technique | Young, H.T.; Lin, C.C.; Liao, H.T. | International Journal of Materials Product Technology | | | |
2007 | Surface Integrity of Silicon Wafer in Ultra Precision Machining | Young, H.T.; Liao, H.T. | Int. J. of Adv. Manuf. Technology | | | |
2004 | Surface integrity of silicon wafers in ultra precision machining | Young, H.T.; Liao, H.T.; Huang, H.Y.; YoungHT | International Journal of Advanced Manufacturing Technology | | | |