公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2010 | The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads | Lin, Hsiu-Jen; Chuang, Tung-Han | Materials Letters | 9 | 8 | |
2010 | Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints | Lin, Hsiu-Jen; Chuang, Tung-Han | Journal of Electronic Materials | 14 | 9 | |
2010 | Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints | Lin, Hsiu-Jen; Chuang, Tung-Han | Journal of Alloys and Compounds | 25 | 20 | |
2011 | Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish | Lin, Hsiu-Jen; TUNG-HAN CHUANG | Microelectronics Reliability | 12 | 10 |