公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2014 | Adaptive phase field modeling of morphological instability and facet formation during directional solidification of SiGe alloys | Lin, H.K.; Chen, H.Y.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2011 | Adaptive three-dimensional phase-field modeling of dendritic crystal growth with high anisotropy | Lin, H.K.; Chen, C.C.; CHUNG-WEN LAN | Journal of Crystal Growth | 28 | 25 | |
2016 | Evolution of grain structures during directional solidification of silicon wafers | Lin, H.K.; Wu, M.C.; Chen, C.C.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2017 | A multilayer nucleation model for twinning during directional solidification of multi-crystalline silicon | Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2014 | Phase field modeling of facet formation during directional solidification of silicon film | Lin, H.K.; Chen, H.Y.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2017 | Phase field modeling of grain structure evolution during directional solidification of multi-crystalline silicon sheet | Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2014 | Phase field modeling with large interface thickness and undercooling | Chen, C.C.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2016 | Phase-field modeling of twin-related faceted dendrite growth of silicon | Chen, G.Y.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Acta Materialia | | | |
2018 | Possible Twinning Operations during Directional Solidification of Multicrystalline Silicon | Jhang, J.W.; Jain, T.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Crystal Growth and Design | | | |
2017 | Revisiting the twinning mechanism in directional solidification of multi-crystalline silicon sheet | Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Acta Materialia | | | |
2013 | A simple anisotropic surface free energy function for three-dimensional phase field modeling of multi-crystalline crystal growth | Lin, H.K.; Chen, C.C.; CHUNG-WEN LAN | Journal of Crystal Growth | 17 | 21 | |
2018 | Three dimensional modelling of grain boundary interaction and evolution during directional solidification of multi-crystalline silicon | Jain, T.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2014 | Three-dimensional phase field modeling of silicon thin-film growth during directional solidification: Facet formation and grain competition | Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | | | |
2018 | Twinning mechanism at three-grain tri-junction during directional solidification of multi-crystalline silicon | Jain, T.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Acta Materialia | | | |