公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Characterization of thin films and intermetallic compounds in solder joint | Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 | |||
2004 | A pilot plant study using ceramic membrane microfiltration, carbon adsorption and reverse osmosis to treat CMP (chemical mechanical polishing) wastewater | Lo, R.; Lo, S. L. | Water Science and Technology: Water Supply |