公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2004 | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | Tsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO | Journal of Electronic Materials | 63 | 57 | |
2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 16 | |
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A |