公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards | T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 | |
2004 | A novel approach for the incorporation of arbitrary linear lumped network into FDTD method | T.-L. Wu; Y.-S. Huang; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 28 | 23 | |
2005 | A novel embedded power plane with 10GHz stopband for simultaneous switching noise | C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 0 | ||
2004 | A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures | T.-L. Wu; Y.-H. Lin; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 93 | 73 | |
2006 | A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit | T.-L. Wu; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 42 | 34 | |
2006 | An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits | T.-L. Wu; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 6 | 6 | |
2006 | Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation | S. Sun; D. Pommerenke; J. Drewniak; K. Xiao; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 7 | ||
2004 | Chip-level model of switching noise coupling on integrated system combining package and printed circuit board | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | |||
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | |||
2005 | Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 227 | 187 | |
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2006 | Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure | H.-C. Kuo; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | 0 | 0 | |
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | T.-L. Wu; S.-T. Chen; J.-N. Huang; Y.-H. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 97 | 71 | |
2005 | Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages | S.-T. Chen; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. |