Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2006 | Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrate | Hsu, H.-J.; Huang, J.-T.; Chao, P.-S.; Wu, C.-S.; Shih, S.-H.; Yang, S.-Y.; SEN-YEU YANG | 2006 International Conference on Electronic Materials and Packaging |