Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2014 | Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals | Li C.C.; Shih W.L.; Chung C.K.; C. ROBERT KAO | Corrosion Science | |||
2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2014 | Effects of silver addition on Cu-Sn microjoints for chip-stacking applications | Yang T.L.; Yu J.J.; Shih W.L.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 40 | 40 | |
2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
2014 | Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications | Yang T.L.; Shih W.L.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
2014 | Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints | Li C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 28 | 26 |