公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
1998 | Comparison of Cure Conditions for a Rigid Rod Epoxy and a Bisphenol A Epoxy Using Thermomechanical Analysis | Su, W-F. A.; Schoch, K-F; Smith, J-D B. | J. Appl. Polym. Sci. | |||
1995 | Electroluminescent edge emission from poly (phenylene vinylene) films | Su, W-F. A.; R-M Young, Schoch, K-F; Smith, J-D B. | Thin Solid Films | |||
1988 | UV Curable Adhesives for Electronic Packaging | Su, W-F. A.; Smith, J-D B.; Long, A-H | SAMPE Journal |