公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2012 | A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Microwave and Wireless Components Letters | 41 | 37 | |
2011 | Accuracy-improved through-silicon-via model using conformal mapping technique | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Elect. Performance Electron. Package. Systems | 6 | 0 | |
2014 | An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect | C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 9 | |
2016 | Super-resolution two-photon fluorescence microscopy through fluorescence saturation | T.-Y. Cheng; S.-Y. Lee; J.-C. Lee; R. Oketani; C.-Y. Lin; C.-T. Yen; H.-J. Tsai; K. Fujita; S. Kawata; C.-K. Sun; CHI-KUANG SUN ; 孫啟光 | Program and Abstract Book of Focus on Microscopy (FOM 2016) |