公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2012 | Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process | Tang, C.-W.; Young, H.-T.; HONG-TSU YOUNG ; KUAN-MING LI | Advanced Materials Research | 1 | 0 | |
2011 | Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method | Lin, C.-C.; Young, H.-T.; Tang, C.-W.; Tsai, M.-Y.; HONG-TSU YOUNG | International Journal of Abrasive Technology | | | |
2013 | Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy | Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG ; KUAN-MING LI | Microelectronics Reliability | | | |
2012 | Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process | Tang, C.-W.; Li, K.-M.; Young, H.-T.; HONG-TSU YOUNG ; KUAN-MING LI | Micro and Nano Letters | | | |
2020 | Multiomics Reveals Ectopic ATP Synthase Blockade Induces Cancer Cell Death via a lncRNA-mediated Phospho-signaling Network | Chang, Y.-W.; CHIA-LANG HSU ; Tang, C.-W.; Chen, X.-J.; Huang, H.-C.; Juan, H.-F. | Molecular and Cellular Proteomics | 12 | 9 | |
2012 | Robust process design towards through-silicon via quality improvement based on Grey-Taguchi method | Tang, C.-W.; Chuang, L.-C.; Young, H.-T.; Yang, M.; HONG-TSU YOUNG | Applied Mechanics and Materials | 0 | 0 | |
2013 | Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application | Tang, C.-W.; Young, H.-T.; HONG-TSU YOUNG | Materials Science in Semiconductor Processing | | | |