公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2009 | 3510-V 390-mΩ · cm2 4H-SiC lateral JFET on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-G.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | IEEE Electron Device Letters | | | |
2012 | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Lin, L.J.-H.; Chang, H.-P.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | 10 | 0 | |
2015 | A Circular-Ring Miniaturized-Element Metasurface With Many Good Features for Frequency Selective Shielding Applications | Huang, F.-C.; Chiu, C.-N.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Electromagnetic Compatibility | 55 | 51 | |
2014 | A novel 2.5-dimensional ultraminiaturized-element frequency selective surface | Yu, Y.-M.; Chiu, C.-N.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Antennas and Propagation | 70 | 58 | |
2012 | A novel TSV model considering nonlinear MOS effect for transient analysis | Chen, K.-Y.; Sheu, Y.-A.; Cheng, C.-H.; Lin, J.-H.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | 11 | 0 | |
2010 | A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: Modeling and application in RF-SiP | Hsieh, C.-Y.; Wang, C.-D.; Lin, K.-Y.; Wu, T.-L.; TZONG-LIN WU ; KUN-YOU LIN | IEEE Transactions on Advanced Packaging | 15 | 13 | |
2013 | Active magnetic field canceling system | Sun, W.-L.; Chuang, F.-C.; Song, Y.-L.; Yu, C.; Ma, T.-G.; Wu, T.-L.; Chang, L.-M.; TZONG-LIN WU | EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits | 4 | 0 | |
2019 | Analysis and Design Method of a Novel Absorptive Common-Mode Filter | Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 21 | 18 | |
2011 | Analysis and design of GHz power noise isolation using 45 rotated photonic crystal fence | Ciccomancini Scogna, A.; Orlandi, A.; Wu, T.-L.; Wang, T.-K.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 4 | 0 | |
2020 | Balanced Bandpass Filter with Common-Mode Reflectionless Feature by Terminated Coupled Lines | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 8 | 10 | |
2016 | Balanced bandpass filter with intrinsic common mode suppression using slot coupled lines and microstrip loading lines | Huang, Y.-C.; Lin, C.-Y.; Wu, T.-L.; TZONG-LIN WU | European Microwave Week 2016: "Microwaves Everywhere", EuMW 2016 - Conference Proceedings; 46th European Microwave Conference, EuMC 2016 | 4 | 0 | |
2019 | Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers with Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach | Chen, S.; Lee, W.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 18 | 14 | |
2013 | Behavior of oblong and rectangular bridge columns with conventional tie and multi-spiral transverse reinforcement under combined axial and flexural loads | Wu, T.-L.; Ou, Y.-C.; Yen-Liang Yin, S.; Wang, J.-C.; Wang, P.-H.; Ngo, S.-H.; Yu-Chen Ou | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A | | | |
2008 | Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective | Lin, Y.-H.; Chou, J.; Lu, Y.-C.; Wu, T.-L.; YI-CHANG LU ; HSIN-SHU CHEN ; TZONG-LIN WU | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | 9 | 0 | |
2019 | Compact quasi-elliptic bandpass filter using magnetically coupled LC resonator pair | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 0 | 0 | |
2017 | The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC | Tsai, Z.-M.; Wu, R.-B.; Wu, T.-L.; Chen, S.-Y.; Mao, S.-G.; SHAU-GANG MAO ; SHIH-YUAN CHEN | 2017 IEEE International Conference on Computational Electromagnetics, ICCEM 2017 | 0 | 0 | |
2019 | Design and analysis of an ultraminiaturized frequency selective surface with two arbitrary stopbands | Wei, P.-S.; Chiu, C.-N.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 31 | 27 | |
2019 | Design of a Broadband Common-Mode Filter with Four Transmission Zeros | Chan, C.-K.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 10 | 10 | |
2019 | Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes] | Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave Magazine | 6 | 6 | |
2018 | Dual-band WLAN MIMO antenna with a decoupling element for full-metallic bottom cover tablet computer applications | Chou, J.-H.; Chang, J.-F.; Lin, D.-B.; Wu, T.-L.; TZONG-LIN WU | Microwave and Optical Technology Letters | 15 | 10 | |