公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2013 | ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments | C.-D. Wang; Y.-J. Chang; Y.-C. Lu; P.-S. Chen; W.-C. Lo; Y.-P. Chiou; T.-L. Wu; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 24 | 21 | |
2017 | An accurate and fast substrate noise prediction method with octagonal TSV model for 3-D ICs | Y.-A. Hsu; C.-H. Cheng; Y.-C. Lu; T.-L. Wu; YI-CHANG LU | IEEE Transactions on Electromagnetic Compatibility | 5 | 4 | |
2014 | An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect | C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 9 | |
2012 | Design considerations for radio frequency 3DICs | Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU ; TZONG-LIN WU ; RUEY-BEEI WU ; KUN-YOU LIN | IEEE Elect. Design Adv. Packag. Systems Symp. | 0 | 0 | |
2019 | Impact of Work Function Variation, Line-Edge Roughness, and Ferroelectric Properties Variation on Negative Capacitance FETs | P.-C. Chiu; Y.-C. Lu; VITA PI-HO HU | IEEE Journal of the Electron Devices Society | 19 | 20 |