公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
1993 | Accreditation of scientific journals | Wang C.Y; FENG-HUEI LIN ; Yang S.C. | Biomedical Engineering - Applications, Basis and Communications | 0 | ||
2008 | Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu | Yang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO | Journal of Electronic Materials | 18 | 18 | |
2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | 14 | 17 | |
2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics | |||
2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 20 | |
2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
2007 | Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems | Yang S.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2007 | Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu | Yang S.C.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research | |||
1983 | A study on complications of percutaneous renal biopsy with 2 marker method. | Chen W.Y.; Yang S.C.; Yen T.S.; Hsieh B.S.; TUN-JUN TSAI | Taiwan yi xue hui za zhi. Journal of the Formosan Medical Association | 1 | 0 | |
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | |||
1993 | Why we should have medical optical cards in national health insurance - facts of ignorance of diagnostic examinations and duplication of treatment | MING-JIUM SHIEH ; Yang S.C.; Huang T.F.; Wong J.M.; Guo T.S.; Wang C.Y. | Biomedical Engineering - Applications, Basis and Communications | 0 |