公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2019 | Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints | Yang T.H.; Yu H.Y.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2019 | Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Scientific Reports | 8 | ||
2018 | Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
2019 | A single bonding process for diverse organic-inorganic integration in IoT devices | Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2019 | A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process | Yang T.H.; Yang C.Y.; Shigetou A.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | |||
2020 | Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars | Yu H.Y.; Yang T.H.; Chiu Y.S.; C. ROBERT KAO | Journal of Electronic Materials |