公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing | Ke J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO | Acta Materialia | 54 | 52 | |
2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 73 | |
2015 | Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration | Yang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2014 | Effects of silver addition on Cu-Sn microjoints for chip-stacking applications | Yang T.L.; Yu J.J.; Shih W.L.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 40 | 40 | |
2014 | Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing | Huang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Scripta Materialia | 55 | 52 | |
2016 | Full intermetallic joints for chip stacking by using thermal gradient bonding | Yang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; C. ROBERT KAO | Acta Materialia | |||
2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO | Materials Letters | 15 | 14 | |
2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
2014 | Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer | Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO | Solar Energy Materials and Solar Cells | 31 | 31 | |
2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
2014 | Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications | Yang T.L.; Shih W.L.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2015 | Low temperature bonding for high temperature applications by using SnBi solders | Yang T.L.; Wu J.Y.; Li C.C.; Yang S.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO | Scripta Materialia | 31 | 31 | |
2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
2010 | Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control | Yang T.L.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 |