公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2002 | Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements | Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2000 | Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating | Yeh, M.S.; Chang, C.B.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1997 | Effects of applied pressure on the brazing of superplastic INCONEL718 superalloy | Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2000 | Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy | Yeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1996 | Evaluation of the superplastic formability of SP-inconel 718 superalloy | Yeh, M.S.; Tsau, C.W.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1996 | Evaluation of the superplastic formability of SP-inconel 718 superalloy | Yeh, M.S.; Tsau, C.W; Chuang, T.H | Journal of Materials Engineering and Performance | | | |
1999 | Interfacial Reactions between Liquid Indium and Nickel Substrate | Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1995 | Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer | Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Scripta Metallurgica et Materiala | | | |
2000 | Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al<inf>2</inf>O<inf>3</inf> (p) composite | Yeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |