公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Autotrophic induced heterotrophic bioreduction of bromate in use of elemental sulfur or zerovalent iron as electron donor | Liu, C.; Li, W.; Liu, L.; Yu, H.; Liu, F.; Lee, D.-J.; DUU-JONG LEE | Bioresource Technology | 12 | 12 | |
2015 | Evaluation of humidity correction methods for Vaisala RS92 tropical sounding data | Yu, H.; Ciesielski, P.E.; Wang, J.; Kuo, H.-C.; V{\\"o; HUNG-CHI KUO | Journal of Atmospheric and Oceanic Technology | 16 | 14 | |
2001 | Experimental evidence of the effects of the incentive design in the value of communication | Chi, W.; Yu, H.; Wang, Taychang | American Accounting Association Annual Meeting | | | |
2020 | Exploring mechanisms for generating spin-orbital coupling through donor-acceptor design to realize spin flipping in thermally activated delayed fluorescence | Wang, M.; Chatterjee, T.; Foster, C.J.; Wu, T.; Yi, C.-L.; Yu, H.; Wong, K.-T.; Hu, B.; KEN-TSUNG WONG | Journal of Materials Chemistry C | 21 | 21 | |
2014 | First record of an apparently rare fig wasp feeding strategy: Obligate seed predation | Wang, R.; Matthews, A.; Ratcliffe, J.; Barwell, L.J.; Peng, Y.-Q.; Chou, L.-S.; Yu, H.; Yang, H.-W.; Compton, S.G.; LIEN-SIANG CHOU | Ecological Entomology | 15 | 15 | |
2012 | Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures | Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
2018 | Observation of Quasi-2-Day convective disturbances in the equatorial Indian Ocean during DYNAMO | Yu, H.; Johnson, R.H.; Ciesielski, P.E.; Kuo, H.-C. | Journal of the Atmospheric Sciences | 14 | 15 | |
2012 | Thermal stress aware design for stacking IC with through glass via | Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | | | |