第 1 到 343 筆結果,共 343 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2024 | A Novel Compact Dual-Functional Circuit with Differential-Mode Equalization and Broadband Common-Mode Suppression Using Patterned Ground Plane | Chen, Yu Ren; Lin, Yi Ting; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | |||
2 | 2023 | Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression | Huang, Li Ching; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 0 | 0 | |
3 | 2023 | A Novel Patterned Ground Structure With Shunt and Series Lumped Elements for Synthesizing Absorption Common-Mode Filters | Liu, Hsu Wei; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
4 | 2023 | A Miniaturized Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption | Chen, Siang; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | 0 | |
5 | 2023 | A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application | Ting, Cheng Wu; Liu, Hsu Wei; Liao, Chung Hsing; Lee, Chien Cheng; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | ||
6 | 2023 | An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface | Chien, Yung Chi; Liu, Hsu Wei; Chou, Chiu Chih; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | |||
7 | 2022 | Vertically Polarized Planar Transition for Hollow-Dielectric-Waveguide-Based 5G/6G High-Speed mm-Wave Interconnect | Liu, Chung Yuan; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 0 | 0 | |
8 | 2022 | A Wideband Single-Cell Unidirectional Absorption Common-Mode Filter with Pattern Ground Structure | Liu, Hsu Wei; TZONG-LIN WU | 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022 | 1 | 0 | |
9 | 2022 | Analysis and Design for Broadband Slot Transition from Microstrip to Rectangular Waveguide | Li, Yen Ching; Ting, Cheng Wu; Liu, Chung Yuan; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 0 | 0 | |
10 | 2022 | Reducing the Number of Measurements of a Multiport Circuit Using Covering Designs and Turán Systems | Chien, Yung Chi; Liu, Hsu Wei; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 0 | 1 | |
11 | 2022 | A planar High-efficient W-band Substrate-Integrated-Waveguide Cavity-backed Slot Antenna Array | Lin, Yi Ting; Kuo, Hung Chun; Wu, Po I.; Jhong, Ming Fong; Pan, Po Chih; Liu, Chung Yuan; Wang, Chen Chao; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
12 | 2022 | A Novel Compact Single-Stage Absorption Common-Mode Filter | Liu H; Cheng C; Li P; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 11 | 8 | |
13 | 2022 | A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter | Liu H.-W; Cheng C.-H; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 3 | 4 | |
14 | 2022 | A Novel Absorptive Power Delivery Network for Power Noise Mitigation | Huang L; Cheng C; Chen S; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
15 | 2022 | A 0.6-dB Low Loss and 3-165 GHz Wideband Phase Difference Sub-THz Coupler in 0.18-μm CMOS | Chang Y.-H; Hsieh C.-H; Cheng S.-P; Li Y; Samukawa S; TZONG-LIN WU ; Tsai Z.-M. | IEEE Microwave and Wireless Components Letters | 0 | 0 | |
16 | 2021 | Extraction of Complex Permittivity of Dielectrics on Package from W-band to D-band | Lin Y.-T; Kuo H.-C; Wu P.-I; Jhong M.-F; Pan P.-C; Liu C.-Y; Wang C.-C; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
17 | 2021 | Erratum: A fully integrated arbitrary power divider on printed circuit board by a novel SMD-resistor-free isolation network (IEEE Transactions on Components, Packaging and Manufacturing Technology (2020) 10:11 (1889-1901) DOI: 10.1109/TCPMT.2020.3029782) | Chen S; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | 0 | |
18 | 2021 | Eye Comparison between Unencoded and 128b/130b-encoded NRZ Signals | Weng P.-Y; Chen C.-H; Chen J; Kuo E; Lin E; Chu P; Liao C.-L; Mutnury B; TZONG-LIN WU | EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems | 0 | 0 | |
19 | 2021 | Poles and Stability of Full-Wave PEEC | Chou C.-C; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Antennas and Propagation | 1 | 2 | |
20 | 2021 | Wideband Reconfigurable Power Divider/Combiner in 40-nm CMOS for 5G mmW Beamforming System | Chang Y; KUN-YOU LIN ; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 4 | 1 | |
21 | 2021 | Bridging the Gap between Academia and Industry: MOST 6G Research Program in Taiwan | Peter Hong Y.-W; Shay W.-T; TZONG-LIN WU ; HUNG-YU WEI | 17th IEEE VTS Asia Pacific Wireless Communications Symposium, APWCS 2021 - Proceedings | 0 | 0 | |
22 | 2021 | Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence | Liu C.-Y; DIng H.-E; Wu S.-H; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 3 | 4 | |
23 | 2021 | An Ultrawideband Common-Mode Filter with Cascaded Mushroom-like Structures | Chien Y.-C; Liu H.-W; TZONG-LIN WU | 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021 | 0 | 0 | |
24 | 2021 | Extremely Low-Loss Planar Transition from Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect | Liu C.-Y; Ding H.-E; Wu S.-H; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 2 | 2 | |
25 | 2020 | A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network | Chen, S.; Wu, T.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 5 | 4 | |
26 | 2020 | A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit | Li, P.-J.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 12 | |
27 | 2020 | Balanced Bandpass Filter with Common-Mode Reflectionless Feature by Terminated Coupled Lines | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 8 | 10 | |
28 | 2020 | EMI Reduction Control Based on 8b/10b | Weng, P.-Y.; Chou, C.-C.; TZONG-LIN WU | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 | 0 | 0 | |
29 | 2020 | A cost-efficient air-filled substrate integrated ridge waveguide for mmWave application | Ting, C.-W.; Chen, S.; TZONG-LIN WU | IEEE MTT-S International Microwave Symposium Digest | 1 | 0 | |
30 | 2020 | Miniaturized Dual-Band FSS Suitable for Curved Surface Application | Wei P.-S; Chiu C.-N; Chou C.-C; Wu T.-L.; TZONG-LIN WU | IEEE Antennas and Wireless Propagation Letters | 25 | 18 | |
31 | 2020 | An Improved Method of Finding Complex Permittivity of Lossy Liquids | Liu R.-J; Chou C.-C; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 0 | 0 | |
32 | 2019 | Modeling of radiated emission caused by coaxial-to-microstrip transition | Li, P.-J.; Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 | 1 | 0 | |
33 | 2019 | Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines | Lin, T.-Y.; Huang, Y.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 14 | 15 | |
34 | 2019 | EMI-Reduction Coding Based on 8b/10b | Chou, C.-C.; Weng, S.-S.; Lu, Y.-C.; TZONG-LIN WU ; YI-CHANG LU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
35 | 2019 | Design of a Broadband Common-Mode Filter with Four Transmission Zeros | Chan, C.-K.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 10 | 10 | |
36 | 2019 | Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications | Lin, C.-W.; Shen, C.-K.; Chiu, C.-N.; TZONG-LIN WU | IEEE Transactions on Antennas and Propagation | 7 | 6 | |
37 | 2019 | A Resistor-Free N-Way Power Divider With Simultaneous Output Matching and Isolation | Chen, Siang; Lee, Wei-Chiang; Wu, Tzong-Lin; TZONG-LIN WU | Ieee Microwave and Wireless Components Letters | 0 | 10 | |
38 | 2019 | Enhanced power and signal integrity through layout optimization of high-speed memory systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.-H.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 1 | 0 | |
39 | 2019 | Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure | Liu, H.-W.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 | 1 | 0 | |
40 | 2019 | Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers with Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach | Chen, S.; Lee, W.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 18 | 14 | |
41 | 2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | 1 | 0 | |
42 | 2019 | A Synthesized Method for Common-Mode Noise Suppression Filters With Specified Common-Mode and Differential Mode Response | Huang, Y.-C.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 20 | 18 | |
43 | 2019 | Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes] | Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave Magazine | 6 | 6 | |
44 | 2019 | A power divider with controllable transmission zeros using lumped artificial transmission line | Chen, S.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 2 | 0 | |
45 | 2019 | Compact quasi-elliptic bandpass filter using magnetically coupled LC resonator pair | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 0 | 0 | |
46 | 2019 | A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique | Chan, C.-K.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 13 | |
47 | 2019 | Design and analysis of an ultraminiaturized frequency selective surface with two arbitrary stopbands | Wei, P.-S.; Chiu, C.-N.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 31 | 27 | |
48 | 2019 | A mm-Wave low-loss transition from microstrip line to air-filled substrate integrated wavguide on printed circuit board technology | Ting, C.-W.; Chen, K.-C.; Chen, S.; Wu, T.-L.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 5 | 0 | |
49 | 2019 | Synthesized method of dual-band common-mode noise absorption circuits | Li, P.-J.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 20 | 19 | |
50 | 2019 | Analysis and Design Method of a Novel Absorptive Common-Mode Filter | Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 21 | 18 | |
51 | 2018 | HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding | Huang, Li Hsin; Cheng, Yu Ying; TZONG-LIN WU | EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems | |||
52 | 2018 | Message from the Incoming Editor-in-Chief | Wu, Tzong-Lin; TZONG-LIN WU | Ieee Transactions on Electromagnetic Compatibility | 0 | 0 | |
53 | 2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | 1 | 0 | |
54 | 2018 | Dual-band WLAN MIMO antenna with a decoupling element for full-metallic bottom cover tablet computer applications | Chou, J.-H.; Chang, J.-F.; Lin, D.-B.; Wu, T.-L.; TZONG-LIN WU | Microwave and Optical Technology Letters | 15 | 10 | |
55 | 2018 | A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression | M.-H. Tsai; S.-K. Hsu; C.-K. Shen; P.-S. Wei; C.-H. Chern; T.-L. Wu; TZONG-LIN WU | IEEE/MTT-S International Microwave Symposium | 3 | 0 | |
56 | 2018 | Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network | Y. T. Lin; C. H. Cheng; T. L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 5 | 0 | |
57 | 2018 | A Common-Mode Filter with Three Alterable and Designable Transmission Zeroes | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility (EMC EUROPE) | 0 | 0 | |
58 | 2018 | Chp.16: Differential-Mode Equalizers with Common-Mode Filtering, in Ferran Martin, Lei Zhu, Jiasheng Hong, Francisco Medina, Editor, Balanced Microwave Filters | Tzong-Lin Wu; Chiu-Chih Chou; TZONG-LIN WU | Balanced Microwave Filters | |||
59 | 2018 | Broadband Eight-Port Forward-Wave Directional Couplers and Four-Way Differential Phase Shifter | H. L. Ting; S. K. Hsu; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 10 | 9 | |
60 | 2018 | An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression | P.-S. Wei; M.-H. Tsai; S.-K. Hsu; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 14 | 15 | |
61 | 2018 | An eye diagram improvement method using simulation annealing algorithm | P. J. Li; T. L. Wu; TZONG-LIN WU | IEEE 22nd Workshop on Signal and Power Integrity (SPI) | 2 | 0 | |
62 | 2018 | A Resistor-Free Absorptive Common-Mode Filter Using Gap-Coupled Resonator | P.-J. Li; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 18 | 16 | |
63 | 2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | L. H. Yen; TZONG-LIN WU ; Ssu-Hao Su; Che-Yao Fan; Fang-Hsien Chu; Fang-Yao Kuo; Hsin-Chia Lu; Shau-Gang Mao; Kun-You Lin; Tsung-Chieh Yen; Tzong-Lin Wu; HSIN-CHIA LU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 2 | 0 | |
64 | 2018 | Signal/Power Integrity Co-Simulation of DDR3 Memory Module | C.-K; Chan; T.-M. Wu; M.-L. Wu; G.-J. Fan; C. Shiah; C.-C. Lu; T.-L. Wu; TZONG-LIN WU | IEEE International Conference on Computational Electromagnetics (ICCEM) | 6 | 0 | |
65 | 2018 | Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability | C. W. Lin; C. K. Shen; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 15 | 14 | |
66 | 2018 | Codesign of Electrostatic Discharge Protection Device and Common Mode Suppression Circuit on Printed Circuit Board | C. Y. Lin; Y. C. Huang; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 5 | 5 | |
67 | 2018 | Investigation on Degradation of Common Mode Noise Suppression with Electrostatic Discharge Protection Array | C.-Y. Lin; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility - EMC EUROPE | 0 | 0 | |
68 | 2017 | A super broadband DGS-based common-mode filter with a compact dimension | P. J. Li; T. L. Wu; TZONG-LIN WU | IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | 0 | 0 | |
69 | 2017 | A simple method to improve signal integrity of electrostatic discharge protection devices | Y. C. Huang; C. Y. Lin; T. L. Wu; TZONG-LIN WU | IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | 1 | 0 | |
70 | 2017 | A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology | H.-L. Ting; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 23 | 24 | |
71 | 2017 | An efficient partition analysis for electromagnetic interference estimation of high-speed input/output differential interfaces | C. K. Shen; T. L. Wu; T. M. Shen; C. Y. Hsiao; T. K. Wang; K. Y. Chen; TZONG-LIN WU | IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) | 0 | 0 | |
72 | 2017 | EMI-reduction coding based on 8b/10b | C.-C. Chou; T.-L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) | 2 | 0 | |
73 | 2017 | Electrostatic discharge protection device and common mode suppression circuit on printed circuit board codesign | C.-Y. Lin; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 1 | 0 | |
74 | 2017 | Analysis of peak and statistical spectrum of random nonreturn-to-zero digital signals | C.-C. Chou; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 0 | 0 | |
75 | 2017 | A modal-analysis-based prediction method for radiation power in differential channels with discontinuity | C. H. Cheng; T. L. Wu; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility - EMC EUROPE | 1 | 0 | |
76 | 2017 | Via optimization for next generation speeds | S. Chen; C. Chen; C. L. Liao; J. Chen; T. L. Wu; B. Mutnury; TZONG-LIN WU | IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | 4 | 0 | |
77 | 2017 | A Novel Absorptive Common-Mode Filter for Cable Radiation Reduction | P.-J. Li; Y.-C. Tseng; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 29 | 27 | |
78 | 2016 | A quadruplet-resonator based ferrite-free choke for suppressing noise currents on cable shielding | Y.-C. Tseng; H.-L. Ting; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 1 | 1 | |
79 | 2016 | Promoting Effective Education in Electromagnetics: Taiwan's School of Accessible and Visualized Electromagnetics Formed [Education Corner] | Liao, W.-J.; Wu, R.-B.; Wu, T.-L.; Ma, T.-G.; Pang, Y.-H.; Tsai, Z.-M.; Yu, H.-H.; Tu, K.-M.; Lin, H.-C.; TZONG-LIN WU ; RUEY-BEEI WU | IEEE Antennas and Propagation Magazine | 5 | 4 | |
80 | 2016 | Beamforming broadside antenna array for 60-GHz technology | Chen, I.-J.; Tseng, Y.-C.; TZONG-LIN WU | RFIT 2016 - 2016 IEEE International Symposium on Radio-Frequency Integration Technology | 4 | 0 | |
81 | 2016 | Balanced bandpass filter with intrinsic common mode suppression using slot coupled lines and microstrip loading lines | Huang, Y.-C.; Lin, C.-Y.; Wu, T.-L.; TZONG-LIN WU | European Microwave Week 2016: "Microwaves Everywhere", EuMW 2016 - Conference Proceedings; 46th European Microwave Conference, EuMC 2016 | 4 | 0 | |
82 | 2016 | A Rigorous Proof on the Radiation Resistance in Generalized PEEC Model | C. C. Chou; W. C. Lee; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 12 | 11 | |
83 | 2016 | Promoting Effective Education in Electromagnetics - Taiwan��s School of Accessible and Visualized Electromagnetics Formed | W.-J. Liao; R.-B. Wu; T.-L. Wu; T.-G. Ma; Y.-H. Pang; Z.-M. Tsai; H.-H. Yu; K.-M. Tu; H.-C. Lin; S.-T. Peng; TZONG-LIN WU | IEEE Antennas and Propagation Magazine | |||
84 | 2016 | Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications | C.-K. Shen; S. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 19 | 16 | |
85 | 2016 | Study of Frequency Offset Behavior for Artificial Magnetic Structure in Compact Mobile Device | C.-Y. Liu; C.-K. Shen; S.-Y. Chen; T.-L. Wu; J.-J. Chang; B.-C. Tseng; J. Yen; TZONG-LIN WU | IEEE International Symposium on Antennas and Propagation (APSURSI) | 0 | 0 | |
86 | 2016 | Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band | P.-J. Li; C.-H. Cheng; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE 20th Workshop on Signal and Power Integrity (SPI) | 4 | 0 | |
87 | 2016 | A Radiation Prediction Method based on Partial Element Equivalent Circuit | Y.-A. Hsu; C.-C. Chou; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) | 1 | 0 | |
88 | 2016 | Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands | C.-W. Lin; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 2 | 0 | |
89 | 2016 | Radiation mechanism and solution of cable attached differential signals | P.-J. Li; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) | 0 | 0 | |
90 | 2016 | E shape resonator dualband common mode filter | C.-Y. Lin; T.-L. Wu; TZONG-LIN WU | IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) | 3 | 0 | |
91 | 2016 | Investigation of the Radiated Emissions From High-Speed/High-Density Connectors | H.-C. Chen; S. Connor; M. S. Halligan; X. Tian; X. Li; B. Archambeault; J. L. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 7 | 7 | |
92 | 2016 | A Resonator-Based Suppressor for Mitigating the Noise Transfer on Metal Plates for Control of Electromagnetic Interference | Y. J. Lin; Y. C. Tseng; T. L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 2 | 2 | |
93 | 2016 | A Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption | S. Chen; W.-C. Lee; T.-L. Wu; TZONG-LIN WU | IEEE MTT-S International Microwave Symposium (IMS) | 6 | 0 | |
94 | 2016 | Balanced Bandpass Filter With Reflectionless common-mode Suppression | T.-Y. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 3 | 0 | |
95 | 2016 | An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs) | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IIEEE Transactions on Electromagnetic Compatibility | 27 | 27 | |
96 | 2015 | Estimation Method for Statistical Eye Diagram in a Nonlinear Digital Channel | C.-C. Chou; S.-Y. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 17 | 17 | |
97 | 2015 | An Ultra-Compact Common-Mode Bandstop Filter With Modified-T Circuits in Integrated Passive Device (IPD) Process | C.-Y. Hsiao; Y.-C. Huang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 46 | 39 | |
98 | 2015 | Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe | C. H. Chen; Y. C. Tseng; I C. Lin; C. C. Fu; K. H. Liao; T. L. Wu; TZONG-LIN WU | IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | 13 | 0 | |
99 | 2015 | A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs | Y. A. Hsu; C. H. Cheng; Y. C. Lu; T. L. Wu; TZONG-LIN WU | IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | 0 | 0 | |
100 | 2015 | Effective Current Distribution Analysis Method for Multiconductor-Transmission-Line (MTL) System with Arbirary Conductor Number Variation | C.-H. Cheng,; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 1 | 0 | |
101 | 2015 | Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas | Y.-C. Tseng; P.-Y. Weng; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
102 | 2015 | Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band | C.-K. Shen; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
103 | 2015 | Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG | Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 0 | 0 | |
104 | 2015 | A Via-Based Methodology for Frequency Selective Surface Minimization | Y.-M. Yu; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Antennas Propag. | 1 | 0 | |
105 | 2015 | A New Broadband Common-Mode Noise Absorption Circuit for High-Speed Differential Digital Systems | C.-Y. Hsiao; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 57 | 53 | |
106 | 2015 | A SMD-Type Filter Solution for EMI/RFI Mitigation on High-Speed Digital Interfaces and Its Application | Y.-J. Lin; Y.-C. Tseng; C.-Y. Hsiao; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 2 | 0 | |
107 | 2015 | Tri-Section Quarter Wavelength Resonator Common Mode Filter | C.-Y. Lin; Y.-C. Huang; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 5 | 0 | |
108 | 2015 | Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology | C.-K. Shen; M.-H. Tsai; H.-N. Chen; C.-P. Jou; Sally Liu; F.-L. Hsueh; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 1 | 0 | |
109 | 2015 | A Compact Dual-Band Common-Mode Filtering Component for EMC in Wireless Communication | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 1 | 0 | |
110 | 2015 | Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP) | C.-H. Chen; Y.-C. Tseng; I-C. Lin; C.-C. Fu; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 9 | 0 | |
111 | 2015 | Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression | C.-K. Shen; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 6 | |
112 | 2015 | An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces | Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Antennas and Propagation | 47 | 41 | |
113 | 2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | 7 | 0 | |
114 | 2015 | SAVE and iEMPT: The em revitalization program in Taiwan | Ma, T.-G.; Liao, W.-J.; Chen, S.-Y.; Wu, T.-L.; Wu, R.-B.; Hsu, H.-T.; Peng, S.T.; Tsai, Z.-M.; Pang, Y.-H.; Yu, H.-H.; Tu, J.-M.; RUEY-BEEI WU ; TZONG-LIN WU ; SHIH-YUAN CHEN | IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) | 0 | 0 | |
115 | 2015 | The 2015 Asia-Pacific international symposium on electromagnetic compatibility | Wu, T.-L.; TZONG-LIN WU | IEEE Electromagnetic Compatibility Magazine | 0 | 0 | |
116 | 2015 | A Circular-Ring Miniaturized-Element Metasurface With Many Good Features for Frequency Selective Shielding Applications | Huang, F.-C.; Chiu, C.-N.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Electromagnetic Compatibility | 55 | 51 | |
117 | 2015 | Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands | W.-Y. Hsu; C.-K. Shen; T.-L. Wu; Ch.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium | 1 | 0 | |
118 | 2014 | A novel common-mode filter (CMF) design based on signal interference technique | C.-H. Hung; C.-Y. Hsiao; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) | 2 | 0 | |
119 | 2014 | Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University | H. Wang; T.-L. Wu; P. Hsu; R.-B. Wu; K.-Y. Lin; T.-W. Huang; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 0 | ||
120 | 2014 | 數位電子元件 | 吳宗霖; 蔡仲豪; TZONG-LIN WU | ||||
121 | 2014 | Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures | S.-K. Hsu; C.-C. Tseng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 1 | ||
122 | 2014 | 共模雜訊抑制電路 | TZONG-LIN WU ; 吳宗霖; 翁翠微; 蕭志穎 | ||||
123 | 2014 | 濾波裝置與濾波電路 | 吳宗霖; 蔡仲豪; 蕭志穎; TZONG-LIN WU | ||||
124 | 2014 | Statistical eye diagram prediction for a 8b10b-coded channel using pulse response | C.-C. Chou; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS) | 6 | 0 | |
125 | 2014 | Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements | F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Antennas and Wireless Propagation Letters | 29 | 26 | |
126 | 2014 | A novel dual-function circuit combining high-speed differential equalizer and common-mode filter with an additional zero | C.-Y. Hsiao; T.- L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 11 | 9 | |
127 | 2014 | Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression | C.-K. Shen; T.-L. Wu; C.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 6 | 0 | |
128 | 2014 | Fast prediction of radiation from high-speed/high-density connectors | H.-C. Chen; T.-L. Wu; S. Connor; B. Archambeault; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 2 | 0 | |
129 | 2014 | Synthesis Model and Design of a Common-Mode Bandstop Filter (CM-BSF) With an All-Pass Characteristic for High-Speed Differential Signals | T.-W. Weng; C.-H. Tsai; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 56 | 53 | |
130 | 2014 | 電磁雜訊抑制電路 | 吳宗霖; 蔡仲豪; TZONG-LIN WU | ||||
131 | 2014 | An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect | C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 9 | |
132 | 2014 | Signal integrity: Influence of non-linear driver, different bit rates, and estimation by different algorithms | S.-Y. Hsu; C.-C. Chou; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 0 | ||
133 | 2014 | 傳輸線結構 | TZONG-LIN WU ; 吳宗霖; 莊皓翔; 鄭余任 | ||||
134 | 2014 | A Compact Loop-Slot Mode Combination Antenna for Ultra-thin Tablet Computer with Metallic Bottom Cover | J.-H. Chou; J.-F. Chang; D.-B Lin; H.-J. Li; T.-L. Wu; TZONG-LIN WU | IEEE Antennas and Wireless Propagation Letters | 22 | 18 | |
135 | 2014 | A novel compact balun using a weakly coupled line with grounded resonator | Tsai, C.-H.; Chen, H.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 8 | 5 | |
136 | 2014 | A novel 2.5-dimensional ultraminiaturized-element frequency selective surface | Yu, Y.-M.; Chiu, C.-N.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Antennas and Propagation | 70 | 58 | |
137 | 2013 | Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors | C.-Y. Hsiao; S.-H. Wang; C.-C Wang; W.-S. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 6 | 0 | |
138 | 2013 | A magnetic-field resonant probe with enhanced sensitivity for RF interference applications | H.-H. Chuang; G.-H. Li; E. Song; H.-H. Park; H.-T. Jang; H.-B. Park; Y.-J. Zhang; D. Pommerenke; T.-L. Wu; J. Fan; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 50 | 44 | |
139 | 2013 | Bandwidth enhancement of 4 x 4 butler matrix using broadband forward-wave directional coupler and phase difference compensation | T.-H. Lin; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 33 | 31 | |
140 | 2013 | Electromagnetic noise suppression circuit | Tzong-Lin Wu; Chung-Hao Tsai; TZONG-LIN WU | ||||
141 | 2013 | A novel common-mode filter for multiple differential pairs with low crosstalk and low mode conversion level | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | 1 | 0 | |
142 | 2013 | ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments | C.-D. Wang; Y.-J. Chang; Y.-C. Lu; P.-S. Chen; W.-C. Lo; Y.-P. Chiou; T.-L. Wu; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 24 | 21 | |
143 | 2013 | Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission | Y.-J. Cheng; H.-H. Chuang; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 18 | 17 | |
144 | 2013 | 傳輸線 | TZONG-LIN WU ; 吳宗霖; 莊皓翔; 鄭余任 | ||||
145 | 2013 | Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress | T.-L. Wu; F. Buesink; F. Canavero; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 170 | 145 | |
146 | 2013 | The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors | H.-C. Chen; S. Connor; T.-L. Wu; B. Archambeault; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 12 | 0 | |
147 | 2013 | Compact TSV-based wideband bandpass filters on 3-D IC | Y.-C. Tseng; P.-S. Chen; W.-C. Lo; S.-H. Wu; T.-L. Wu; TZONG-LIN WU | IEEE 63rd Electronic Components and Technology Conference | 7 | 0 | |
148 | 2013 | Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 28 | 13 | |
149 | 2013 | Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures | C.-H. Huang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 26 | 25 | |
150 | 2013 | A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels | J.-C. Yen; S.-K. Hsu; T.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 15 | 13 | |
151 | 2013 | Active magnetic field canceling system | Sun, W.-L.; Chuang, F.-C.; Song, Y.-L.; Yu, C.; Ma, T.-G.; Wu, T.-L.; Chang, L.-M.; TZONG-LIN WU | EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits | 4 | 0 | |
152 | 2013 | Suppression of RF interference using balanced filter in communication system | Chen, H.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Electromagnetic Compatibility Magazine | 0 | ||
153 | 2013 | Test generation of path delay faults induced by defects in power TSV | Shih, C.-J.; Hsieh, S.-A.; Lu, Y.-C.; Li, J.C.-M.; Wu, T.-L.; TZONG-LIN WU ; YI-CHANG LU ; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 2 | 0 | |
154 | 2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | Asia and South Pacific Design Automation Conference, ASP-DAC | 0 | 0 | |
155 | 2012 | Design considerations for radio frequency 3DICs | Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU ; TZONG-LIN WU ; RUEY-BEEI WU ; KUN-YOU LIN | IEEE Elect. Design Adv. Packag. Systems Symp. | 0 | 0 | |
156 | 2012 | A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement | T.-H. Lin, J.-C. Yen, S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 2 | 0 | |
157 | 2012 | Radiation suppression for cable-attached packages utilizing a compact embedded common-mode filter | C.-Y. Hsiao; C.-H. Tsai; C.-N. Chiu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 65 | 59 | |
158 | 2012 | A novel miniaturized bandstop filter using defected ground on system in package (SiP) | T.-W. Weng; T. -L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | 0 | 0 | |
159 | 2012 | Eye prediction of digital driver with power distribution network noise | C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electronics Package Systems | 10 | 0 | |
160 | 2012 | A Novel Dual-Functional Structure Integrating Differential-Mode Equalizer with Common-Mode Filter for Gbps Signaling | Y.-J. Cheng; H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | IEEE Eur. Electromagn. Compat. Conf. | 0 | 0 | |
161 | 2012 | A Branched Reflector Technique to Reduce Crosstalk Between Slot-Crossing Signal Lines | H.-H. Chuang; C.-C. Chou; Y.-J. Chang; T.-Z. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 3 | 3 | |
162 | 2012 | A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP | H.-C. Chen; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 32 | 27 | |
163 | 2012 | A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Microwave and Wireless Components Letters | 41 | 37 | |
164 | 2012 | A new solution and its estimation method for slot-crossing signals to reduce ISI-increased crosstalk | Y.-J. Chang; C.-C. Chou; H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 0 | 0 | |
165 | 2012 | Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes | C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Microwave Theory and Techniques | 38 | 36 | |
166 | 2012 | Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer | Chang, Y.-J.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU et al. | Electronic Components and Technology Conference | 10 | 0 | |
167 | 2012 | Signal integrity design for GHz high-speed differential wires with slip ring capsule | Chen, H.-C.; Hsu, S.-K.; Chang, T.-C.; Chi, W.-C.; Ma, S.-Y.; Wu, T.-L.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 4 | 0 | |
168 | 2012 | A novel TSV model considering nonlinear MOS effect for transient analysis | Chen, K.-Y.; Sheu, Y.-A.; Cheng, C.-H.; Lin, J.-H.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | 11 | 0 | |
169 | 2012 | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Lin, L.J.-H.; Chang, H.-P.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | 10 | 0 | |
170 | 2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | 22 | 0 | |
171 | 2011 | A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis | Y.-J. Cheng; H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Design Adv. Packag. Systems Symp. | 2 | 0 | |
172 | 2011 | A novel compact backward-wave directional coupler desigh with defected ground structure | J.-C. Yen, S.-K. Hsu,; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conf. | |||
173 | 2011 | A novel broadband forward-wave directional coupler design with periodical H-shaped structure | T.-H. Lin; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 3 | ||
174 | 2011 | Size-reduction of 3 dB microstrip forward-wave coupler using defected ground structure | S.-K. Hsu; T.-H. Lin; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 7 | ||
175 | 2011 | A novel and low-cost method for slot-crossing differential line to reduce GHz common-mode radiation in advanced PCB | H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | IEEE IMPAC. | 0 | 0 | |
176 | 2011 | Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence | Y.-L. Song; C.Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Annu. Symp. Antenna Meas. Tech. Association | |||
177 | 2011 | Analysis 2.5-D permutation power transmission line to decrease electro-magnetic influence at high technology nano-fab | Y.-L. Song; C.Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | 2011 International Conference on Energy, Environment and Sustainable Development | 0 | 0 | |
178 | 2011 | A broadband and miniaturized balun on system-in-package (SiP) | C.-H. Tsai; H.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE IMPAC | 1 | 0 | |
179 | 2011 | A novel miniaturized forward-wave directional coupler loaded with periodic shunt inductors | J.-C. Yen; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | Eur. Microw. Conf. | 4 | ||
180 | 2011 | Accuracy-improved through-silicon-via model using conformal mapping technique | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Elect. Performance Electron. Package. Systems | 6 | 0 | |
181 | 2011 | A miniaturized and broadband balun using artificial coupled line with imaginary even-mode impedance | C.-H. Tsai; I.-I. A. Ieong; H.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 6 | 5 | |
182 | 2011 | Suppression of RF interference using balanced filter in communication system | H.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 3 | 0 | |
183 | 2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
184 | 2011 | A novel and cost-effective method to suppress GHz common-mode radiation for slot-crossing differential lines | H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | 0 | |
185 | 2011 | Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | 0 | |
186 | 2011 | A novel common mode choke and its application for 5 Gbps USB 3.0 | C.-H. Tsai; J.-Z. Hsu; I.-I. A. Ieong; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 11 | 0 | |
187 | 2011 | Evaluation of magnetic field from varied permutation power transmission line at high technology nano-fab | Y.-L. Song; C. Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Int. Conf. Power Electron. Systems Applications | 3 | 0 | |
188 | 2011 | Active field canceling system in next generation nano-fab | F.-C. Chuang; Y.-L. Song; C. Yu; S.-K. Hsu; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Int. Conf. Power Electron. Systems Applications | 2 | 0 | |
189 | 2011 | Suppression of common-mode radiation and mode-conversion for slot-crossing GHz differential signals using novel grounded resonators | H.-H. Chuang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 4 | |
190 | 2011 | A novel compact forward-wave directional coupler design using periodical patterned ground structure | S.-K. Hsu, J.-C. Yen,; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 22 | 19 | |
191 | 2011 | Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab | F.-C. Chuang; Y.-L. Song; C. Yu; S.-K. Hsu; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | |||
192 | 2011 | Analysis and design of GHz power noise isolation using 45 rotated photonic crystal fence | Ciccomancini Scogna, A.; Orlandi, A.; Wu, T.-L.; Wang, T.-K.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 4 | 0 | |
193 | 2011 | A new bandstop filter using artificial defected ground structures with compact size and low radiation | Hsu, Y.-H.; Tsai, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 1 | 0 | |
194 | 2010 | Conformal shielding investigation for SiP modules | C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 13 | 0 | |
195 | 2010 | A novel ground resonator technique to reduce common-mode radiation on slot-crossing differential signals | H. H. Chuang; T. L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 8 | 6 | |
196 | 2010 | A novel microstrip forward directional coupler using defected ground structure | S.-K. Hsu; J.-C.Yen; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 0 | ||
197 | 2010 | 電磁雜訊抑制裝置 | 吳宗霖; 王挺光; 莊皓翔; 謝嘉原; TZONG-LIN WU | ||||
198 | 2010 | A new bandastop filter uisng artificial defected ground structures with | Y.-H. Hsu; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 0 | ||
199 | 2010 | A novel time domain method to extract equivalent circuit model of patterned ground structures | C.-H. Cheng; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 17 | 11 | |
200 | 2010 | A novel microstrip forward directional coupler based on an artificial substrate | S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | Eur. Microw. Conf. | 1 | ||
201 | 2010 | A stopband enhanced EBG power/ground plane based on via location design | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Compon. Packag. Manuf. Technol. Symp. Japan | 2 | 0 | |
202 | 2010 | A novel miniaturized forward-wave directional coupler with periodical mushroom-shaped ground plane | S.-K. Hsu; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 24 | 20 | |
203 | 2010 | A new common-mode EMI suppression technique for GHz differential signals crossing slotted reference planes | H.-H. Chuang; T.-L.Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 4 | 0 | |
204 | 2010 | Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology | T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin | IEICE Transactions on Communications | 20 | 13 | |
205 | 2010 | An ultra compact common-mode filter for RF interference control in 3G wireless communication systems | I.-I. A. Ieong; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 | |
206 | 2010 | Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction | A. Ciccomancini; T. L. Wu; A. Orl; i; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 16 | 15 | |
207 | 2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 196 | 161 | |
208 | 2010 | Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis | H.-H. Chuang; YI-CHANG LU ; TZONG-LIN WU ; HSIN-SHU CHEN ; RUEY-BEEI WU et al. | IEEE Transactions on Electromagnetic Compatibility | 29 | 24 | |
209 | 2010 | Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology | W.-Y. Huang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
210 | 2010 | Common mode filtering method and device | Tzong-Lin Wu; Shu-Jung Wu; TZONG-LIN WU | ||||
211 | 2010 | Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure | A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
212 | 2010 | A novel time domain method to extract equivalent circuit model of patterned ground structures | C.-H. Cheng; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 0 | 11 | |
213 | 2010 | Capacitors with insulating layer having embedded dielectric rods | Kuo-Ching Steven Hsu; Chien-Min Lin; Guan-Tzong Wu; Tzong-Lin Wu; TZONG-LIN WU | ||||
214 | 2010 | Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression | G.-Z. Wu; Y.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 18 | 13 | |
215 | 2010 | A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits | H.-H. Chuang; C.-J. Hsu; J. Hong; C.-H. Yu; A. Cheng; J. Ku; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 5 | 3 | |
216 | 2010 | A broadband and miniaturized common-mode filter for gigahertz differential signals based on negative permittivity metamaterials | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 142 | 126 | |
217 | 2010 | A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: Modeling and application in RF-SiP | Hsieh, C.-Y.; Wang, C.-D.; Lin, K.-Y.; Wu, T.-L.; TZONG-LIN WU ; KUN-YOU LIN | IEEE Transactions on Advanced Packaging | 15 | 13 | |
218 | 2009 | Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces | H.-H. Chuang; C.-J. Hsu; M.-Z. Hong; D. Hsu; R. Huang; L.-C. Hsiao; T.-L. Wu; TZONG-LIN WU | IEEE Electron. Design Adv. Packag. Systems Symp. | 8 | 0 | |
219 | 2009 | A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | |||
220 | 2009 | Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression | T.-K. Wang; C.-Y. Hsieh; H.-H. Chuang; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 48 | 40 | |
221 | 2009 | A metamaterial-typed differential transmission line with broadband common-mode suppression | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | 10 | 0 | |
222 | 2009 | Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses | Scogna, A.C.; Orlandi, A.; Ricchiuti, V.; Wu, T.-L.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 5 | 0 | |
223 | 2009 | A Novel Wideband Common-mode Suppression Filter for GHz Differential Signals Using Coupled Patterned Ground Structure | Wu, Shu-Jung; Tsai, Chung-Hao; Wu, Tzong-Lin ; Itoh, Tatsuo | IEEE Transactions on Microwave Theory and Techniques | 182 | 173 | |
224 | 2009 | An ultra compact electromagnetic band gap filter for GHz power noise suppression using LTCC technology | Huang, Y.-W.; Wang, T.-K.; Wu, T.-L.; TZONG-LIN WU | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | 0 | 0 | |
225 | 2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 0 | 0 | |
226 | 2008 | Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory | H.-H. Chuang; S.-J. Wu; M.-Z. Hong; D. Hsu; R. Huang; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 12 | 0 | |
227 | 2008 | A novel stopband-enhanced EBG planes using an embedded slow-wave structure | C.-Y. Hsieh; H.-H. Chuang; T.-K. Wang; C.-C. Wang; H.-H. Cheng; Y.-S. Wu; C.-T. Chiu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 5 | 0 | |
228 | 2008 | A novel HU-shaped common-mode filter for GHz differential signals | S.-J. Wu; H.-H. Chuang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | |||
229 | 2008 | 創新電磁能隙電源平面之電源完整性及電磁相容分析與設計 (新制多年期第1年) | 吳宗霖 | ||||
230 | 2008 | 單封裝系統訊號完整性之前瞻整合研究-子計畫二:單封裝系統高速互連結構設計資料庫之研究與建立(3/3) | 吳宗霖 | ||||
231 | 2008 | 超頻寬光通訊摻鉻光纖製程與特性之研究-子計畫三:摻鉻光纖波導分析之研究(3/3) | 吳宗霖 | ||||
232 | 2008 | 單封裝系統訊號完整性之前瞻整合研究-子計畫二:單封裝系統高速互連結構設計資料庫之研究與建立(2/3) | 吳宗霖 | ||||
233 | 2008 | The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes | C.-H. Shih; G.-H. Shiue; T.-L. Wu; R.-B. Wu; TZONG-LIN WU ; RUEY-BEEI WU | Asia-Pacific Symp. Electromagn. Compat. | 7 | 0 | |
234 | 2008 | 抑制雜訊之內嵌電源平面及包含該電源平面之多層結構 | 吳宗霖; 王挺光; 陳信廷; 王建中; 王陳肇; 歐宏俊; 吳松茂; 蔡志偉; 周佳興; TZONG-LIN WU | ||||
235 | 2008 | A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression | T.-K. Wang; T.-W. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 61 | 45 | |
236 | 2008 | An embedded common-mode suppression filter for GHz differential signals using periodic defected ground plane | W.-T. Liu; C.-H. Tsai; T.-W. Han; T.-L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 195 | 164 | |
237 | 2008 | Anxiety levels in women undergoing prenatal maternal serum screening for down syndrome: the effect of a fast reporting system by mobile phone short-message service | P.-J. Cheng; S.-W. Shaw; H.-Y. Chueh; C.-T. Lin; J.-J. Hsu; T.-T. Hsieh; Y.-K. Soong; TZONG-LIN WU | Prenatal Diagnosis | 31 | 30 | |
238 | 2008 | Fundamentals of signal integrity | Wu, T.-L.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 0 | 0 | |
239 | 2008 | A low cost dual-CPW differential line for two-layer PCBs | Chi, C.-J.; Chih-Wei, T.; Hsieh, J.-S.; Ko, W.-C.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 0 | 0 | |
240 | 2008 | A novel broadband common-mode filter for high-speed differential signals | Liu, W.-T.; Han, T.-W.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 5 | 0 | |
241 | 2008 | Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective | Lin, Y.-H.; Chou, J.; Lu, Y.-C.; Wu, T.-L.; YI-CHANG LU ; HSIN-SHU CHEN ; TZONG-LIN WU | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | 9 | 0 | |
242 | 2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
243 | 2007 | A novel EBG power plane with stopband enhancement using artificial substrate | T.-K. Wang; T.-W. Han; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 3 | 0 | |
244 | 2007 | Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate | Y.-C. Chen; T.-K. Wang; S.-M. Lan; C.-H. Lu; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 0 | 0 | |
245 | 2007 | Broadband ultra-flattened dispersion micro-structured fiber | Tzong-Lin Wu; Chia-Hsin Chao; TZONG-LIN WU | ||||
246 | 2006 | Power plane system of high-speed digital circuit for suppressing ground bounce noise | Tzong-Lin Wu; Yen-Hui Lin; Sing-Ting Chen; Ting-Kuang Wang; TZONG-LIN WU | ||||
247 | 2006 | Theoretical demonstration of enhancement of light extraction of flip-chip GaN light-emitting diodes with photonic crystals | C.-H. Chao; S. L. Chuang; T.-L. Wu; TZONG-LIN WU | Applied Physics Letters | 52 | 43 | |
248 | 2006 | A time-domain approach for extracting broadband macro-π models of differential via holes | C.-C. Wang; C.-W. Ku; C.-C. Kuo; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 8 | 7 | |
249 | 2006 | New package scheme of a 2.5Gb/s plastic tranceiver module employing mutiwall nanotubes for low electromagnetic interference | C.-M. Chang; J.-C. Chiu; W.-S. Jou; W.-H. Cheng; TZONG-LIN WU | IEEE Journal on Selected Topics in Quantum Electronics | 18 | 6 | |
250 | 2006 | Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure | H.-C. Kuo; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | 0 | 0 | |
251 | 2006 | A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit | T.-L. Wu; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 42 | 34 | |
252 | 2006 | Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation | S. Sun; D. Pommerenke; J. Drewniak; K. Xiao; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 7 | ||
253 | 2006 | A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module | T.-L. Wu; M.-C. Lin; C.-W. Lin; W.-S. Jou; T.-T. Shih; W.-H. Cheng; TZONG-LIN WU | Journal of Lightwave Technology | 2 | 2 | |
254 | 2006 | Power splitting analysis of 3×3 photonic crystal | H.-J. Ou; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Optoelectron. Commun. Conf. | |||
255 | 2006 | An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits | T.-L. Wu; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 6 | 6 | |
256 | 2006 | Embedded power plane with ultra-wide stop-band for simultaneously switching noise on high-speed circuits | T. K. Wang; TZONG-LIN WU | Electronics Letters | 18 | 10 | |
257 | 2006 | Analysis of propagation characteristics for an octagonal photonic crystal fiber (O-PCF) | Chiang, Jung-Sheng; TZONG-LIN WU | Optics Communications | 98 | 69 | |
258 | 2005 | 耦合互連結構等效寬頻模型之時域分析系統及方法 | 吳宗霖; 郭俊志; TZONG-LIN WU | ||||
259 | 2005 | Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages | S.-T. Chen; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
260 | 2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
261 | 2005 | Polarization beam splitting in twin- elliptical-core photonic crystal fiber coupler | J.-S. Chiang; T.-L. Wu; TZONG-LIN WU | Int. Symp. Commun. | |||
262 | 2005 | A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure | H.-J. Ou; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Applications Compat. | |||
263 | 2005 | Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 227 | 187 | |
264 | 2005 | 超寬頻色散平坦為結構光纖 | 吳宗霖; 趙嘉信; TZONG-LIN WU | ||||
265 | 2005 | A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards | T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 | |
266 | 2005 | Analysis and solution of modes loss problem for computing the bandgap structure of periodic structures by 2-D FDTD method | H.-J. Ou; T.-L. Wu; TZONG-LIN WU | International Conference on Antennas, Radar and Wave Propagation | 0 | ||
267 | 2005 | 用於多層結構之電源層系統 | 吳宗霖; 林彥輝; 陳信廷; TZONG-LIN WU | ||||
268 | 2005 | Chp.15: High-Speed Electronic Circuits With Active and Nonlinear Components in A. Taflove and S. Hagness, Editor, Computational Electrodynamics: The Finite-Diffeernce Time-Domain Method (3rd Edition) | Melinda Piket-May; Wojciech K. Gwarek; Tzong-Lin Wu; Bijan Houshm; Tatsuo Itoh; J. J. Simpson; TZONG-LIN WU | ||||
269 | 2005 | An efficient approach for calculating the dispersions of photonic crystal fibers: design of the nearly zero ultra-flattened dispersion | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 13 | 11 | |
270 | 2005 | A novel embedded power plane with 10GHz stopband for simultaneous switching noise | C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 0 | ||
271 | 2005 | A novel time-domain method for synthesizing broadband macro-PI models of differential via | T.-L. Wu; C.-C. Wang; C.-C. Kuo; J.-S. Hsieh; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 7 | 5 | |
272 | 2005 | High electromagnetic susceptibility (EMS) plastic package for 10Gbps optical transceiver module | T.-L. Wu; M.-C. Lin; C.-H. Lee; T.-T. Shih; W.-H. Cheng; TZONG-LIN WU | Electronics Letters(SCI) | 7 | 6 | |
273 | 2005 | A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 155 | 6 | |
274 | 2005 | High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules | T.-L. Wu; C.-W. Lin; W.-C. Hung; C.-H. Lee; W.-S. Jou; W.-H. Cheng; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 7 | 6 | |
275 | 2005 | A novel ultra-flattened dispersion photonic crystal fiber | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | IEEE Photonics Technology Letters(SCI) | |||
276 | 2005 | Shielding effectiveness of multi-wall carbon nanotube composite | Chang, C.M.; Wu, T.L.; Chiu, J.C.; Lin, C.W.; Jou, W.S.; Cheng, W.H.; TZONG-LIN WU | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS | 0 | 0 | |
277 | 2005 | A novel ultraflattened dispersion photonic crystal fiber | Wu, T.-L.; Chao, C.-H.; TZONG-LIN WU | IEEE Photonics Technology Letters | 171 | 135 | |
278 | 2004 | A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits | T.-K. Wang; C.-C. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Application Compat. | |||
279 | 2004 | Chip-level model of switching noise coupling on integrated system combining package and printed circuit board | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | |||
280 | 2004 | Low cost and low electromagnetic interference packaging of optical transceiver modules | W.-H. Cheng; W.-C.Hung; C.-H. Lee; G.-L. Hwang; W.-S. Jou; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 27 | 20 | |
281 | 2004 | Analysis of radiation caused by SSN and transmission line by combining the equivalent circuits of active IC into FDTD | Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 7 | ||
282 | 2004 | A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures | T.-L. Wu; Y.-H. Lin; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 93 | 73 | |
283 | 2004 | A novel approach for calculating the dispersions of photonic crystal fibers | T.-L. Wu; J.-S. Chiang; C.-H. Chao; TZONG-LIN WU | IEEE Photonics Technology Letters(SCI) | 13 | 11 | |
284 | 2004 | A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding | T.-L. Wu; W.-C. Hung; C.-H. Lee; C.-W. Lin; W.-S. Jou; W.-H. Cheng; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 2 | ||
285 | 2004 | A high shielding effectiveness plastic package for 2.5Gbps optical transceiver module | T.-L. Wu; W.-S. Jou; W.-C. Hung; C.-H. Lee; C.-W. Lin; W.-H. Cheng; TZONG-LIN WU | Electronics Letters | 4 | 3 | |
286 | 2004 | A novel time-domain algorithm for synthesizing broadband macromodels of coupled interconnects | C.-C. Kuo; C.-C. Wang; S.-M. Wu; C.-P. Hung; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 2 | 2 | |
287 | 2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | T.-L. Wu; S.-T. Chen; J.-N. Huang; Y.-H. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 97 | 71 | |
288 | 2004 | A novel approach for the incorporation of arbitrary linear lumped network into FDTD method | T.-L. Wu; Y.-S. Huang; S.-T. Chen; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 28 | 23 | |
289 | 2004 | Rigorous analysis of polarization dependence loss (PDL) for equilateral 3x3 fused fiber couplers | T.-L. Wu; H.-J. Ou; TZONG-LIN WU | IEEE Photonics Technology Letters | 4 | 0 | |
290 | 2004 | Photonic crystal fiber analysis through the vector boundary-element method: effect of elliptical air hole | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | IEEE Photonics Technology Letters | 34 | 30 | |
291 | 2003 | Photonic crystal fiber analysis through vector boundary-element method | C.-H. Chao; T.-L. Wu; TZONG-LIN WU | Pacific Rim Conf. Lasers Electro-Optics | 0 | 0 | |
292 | 2003 | A novel periodic structures in photonic crystal fibers | J.-S. Chiang; T.-L. Wu; TZONG-LIN WU | Pacific Rim Conf. Lasers Electro-Optics | 0 | 0 | |
293 | 2003 | 3D electromagnetic modeling of polarization-dependent coupling characteristics of 1x3 linear array weakly fused fiber couplers | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | Fiber and Integrated Optics | 0 | 0 | |
294 | 2003 | Polarization and dispersion analysis of holey fibers with elliptical air holes through the vector boundary-element method | C.-H. Chao; TZONG-LIN WU | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS | 0 | ||
295 | 2003 | Electromagnetic shielding of plastic packaging in cost-effective optical transceiver modules | W.-H. Cheng; W.-S. Jou; TZONG-LIN WU | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS | 2 | ||
296 | 2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | |||
297 | 2003 | A novel systematic approach for equivalent model extraction of embedded high-speed interconnects in time domain | C.-C. Kuo; H.-C. Chang; J.-S. Shie; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 10 | 10 | |
298 | 2003 | A vector power coupling model for analyzing polarization dependent loss (PDL) of equilateral triangular 3x3 weakly fused fiber couplers | T.-L. Wu; H.-J. Ou; TZONG-LIN WU | Optics Communications | 4 | 4 | |
299 | 2003 | Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules | T.-L. Wu; W.-S. Jou; S.-G. Dai; W.-H. Cheng; TZONG-LIN WU | Journal of Lightwave Technology | 25 | 22 | |
300 | 2003 | Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique | C.-C. Kuo; T.-L. Wu; TZONG-LIN WU | Int. Zurich Symp. Technical Exhibit. Electromagn. Compat. | |||
301 | 2003 | Real-time scheduling for elevator group systems | Chang, K.-M.; Chen, C.-L.; Wu, T.-L.; TZONG-LIN WU | Systems Analysis Modelling Simulation | 0 | 0 | |
302 | 2002 | NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | ||
303 | 2002 | Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 25 | ||
304 | 2002 | A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects | H.-C. Chang; C.-C. Kuo; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | ||
305 | 2002 | The influence of fiber orientation on electromagnetic shielding in liquid crystal polymers | W.-S. Jou; S.-K. Chiu; W.-H. Cheng; TZONG-LIN WU | Journal of Electronic Materials | 42 | 30 | |
306 | 2002 | Effect of carbon-fiber orientation on the EM shielding for the plastic laser module packages | Dai, S.G.; Li, P.L.; Jou, W.S.; Wu, T.L.; Cheng, W.H.; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 1 | 0 | |
307 | 2002 | More analyses for the service performance of elevator group systems | Chang, K.-M.; Wu, T.-L.; TZONG-LIN WU | Systems Analysis Modelling Simulation | 0 | 0 | |
308 | 2001 | The effect of test system impedance on measurements of ground bounce in printed circuit boards | T.-L. Wu; Y.-H. Lin; J.-N. Huang; J.-J. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 7 | 6 | |
309 | 2001 | NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Electromagn. Compat. Conf. | |||
310 | 2001 | Electromagnetic shielding of nylon-66 composites applied to laser modules | W.-S. Jou; T.-L. Wu; S.-K. Chiu; W.-H. Cheng; TZONG-LIN WU | Journal of Electronic Materials | 33 | 26 | |
311 | 2001 | Crosstalk characterization of high-speed interconnects in time-domain | C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 3 | ||
312 | 2001 | The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 14 | ||
313 | 2001 | Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement | Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 26 | ||
314 | 2001 | Electromagnetic shielding of plastic packaging in laser diode modules | S.-K. Chiu; J.-Y. Cheng; W.-S. Jou; S.-C. Wang; C.-M. Wang; C.-S. Lin; T.-L. Wu; W.-H. Cheng; TZONG-LIN WU | Electron. Compon. Technol. Conf. | |||
315 | 2001 | Optimum approach for fabrication of low loss fused fiber couplers | Hsieh, C.S.; Wu, T.L.; Cheng, W.H.; TZONG-LIN WU | Materials Chemistry and Physics | 28 | 18 | |
316 | 2001 | Electromagnetic shielding of plastic material in laser diode modules | Chiu, S.K.; Cheng, J.Y.; Jou, W.S.; Jong, G.J.; Wang, S.C.; Wang, C.M.; Lin, C.S.; Wu, T.L.; Cheng, W.H.; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 1 | 0 | |
317 | 2000 | Electromagnetic shielding of plastic packaging in low-cost laser modules | Cheng, W.H.; Cheng, J.Y.; Wu, T.L.; Wang, C.M.; Wang, S.C.; Jou, W.S.; TZONG-LIN WU | Electronics Letters | 14 | 14 | |
318 | 2000 | Three-Dimensional Electromagnetic Modeling of Fiber-Core Effects on the Coupling Characteristics of Weakly Fused Tapered Fiber-Optic Couplers | Wu, T.-L.; TZONG-LIN WU | Journal of Lightwave Technology | 13 | 8 | |
319 | 1999 | Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers | T.-L. Wu; TZONG-LIN WU | Microwave and Optical Technology Letters | 4 | ||
320 | 1999 | Rigorous analysis of fiber-core effect for fused fiber-optic couplers | T.-L. Wu; TZONG-LIN WU | IEEE Inter. Symp. Antenna Propag | |||
321 | 1999 | Bypass capacitance effect both on the signal integrity and electromagnetic radiation for high-speed clock circuits | S.-C. Chao; T.-L. Wu; TZONG-LIN WU | Progress in Electromagnetics Research Symposium | |||
322 | 1999 | Rigorous analysis of polarization effect of wavelength-flattened fused fiber-optic couplers | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Progress in Electromagnetics Research Symposium | |||
323 | 1998 | Numerical modeling of weakly fused fiber-optic polarization beamsplitter - part II: the three-dimensional electromagnetic model | S.-W. Yang; T.-L. Wu; C.-W. Wu; H.-C. Chang; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 43 | 28 | |
324 | 1997 | Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure | H.-C. Chang; C.-W. Wu; T.-L. Wu; S.-W. Yang; G.-J. Liao; TZONG-LIN WU | Taiwan Optoelectron. Ind. Technol. Develop. Conf. | |||
325 | 1997 | Vectorial analysis of fiber-core effects in weakly fused couplers | T.-L. Wu; TZONG-LIN WU | IEEE Photonics Technology Letters (SCI) | 5 | 4 | |
326 | 1995 | All-Fiber Brewster Windows Made with Extremely Weakly Fused Asymmetric Coupler | C.-W. Wu; S.-T. Lu; H.-C. Chang; TZONG-LIN WU | IEEE Photonics Technology Letters | 2 | 2 | |
327 | 1995 | Accurate coupling coefficients for fiber couplers with weakly-fused cross sections | H.-C. Chang; T.-H. Lin; T.-L. Wu; TZONG-LIN WU | Applied Optics(SCI) | 7 | 6 | |
328 | 1995 | An efficient numerical approach for determining the dispersion characteristics of dual-mode elliptical-core optical fibers | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 3 | 0 | |
329 | 1995 | Three-dimensional modeling of fused biconical optical fiber coupling devices | H.-C. Chang; T.-L. Wu; C.-W. Wu; TZONG-LIN WU | Progress in Electromagn. Research Symp. | |||
330 | 1995 | A novel fabrication method for all-fiber weakly fused polarization beamsplitters | C.-W. Wu; T.-L. Wu; H.-C. Chang; TZONG-LIN WU | IEEE Photonics Technology Letters(SCI) | 42 | 27 | |
331 | 1995 | Simulation of polarization and spectral responses of fused tapered fiber-optic couplers | T.-L. Wu; C.-W. Wu; H.-C. Chang; TZONG-LIN WU | Int. Conf. Integr. Opt. Optical Fibre Commun. | |||
332 | 1995 | Rigorous analysis of form birefringence of weakly fused fiber-optic couplers | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 15 | 12 | |
333 | 1995 | Form birefringence of biconical-taper fiber-optic couplers under weakly fused condition | T.-L. Wu; H.-C. Chang,; TZONG-LIN WU | Topical Meeting Integr. Photon. Research | |||
334 | 1995 | A novel dispersion calculation method for elliptical-core fiber-optic dispersion compensators | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Int. Symp. Commun. | |||
335 | 1994 | Rigorous analysis of form birefringence of fused fibre couplers | TZONG-LIN WU ; Chang, H.-C. | Electronics Letters | |||
336 | 1994 | Rigorous analysis of form birefrigence of fused fiber couplers | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Electronics Letters(SCI) | 7 | 4 | |
337 | 1994 | A vectorial simulation model for fused tapered optical couplers | T.-L. Wu; H.-C. Chang; TZONG-LIN WU | Topical Meeting Integr. Photon. Research | |||
338 | 1992 | 多層板中連通柱的等效電路分析 | 吳瑞北 ; 郭建男; 吳宗霖 ; 陳威霖; Wu, Ruey-Beei | ||||
339 | 1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | 4 | 0 | |
340 | 0 | Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal | Tzong-Lin Wu; Chung-Hao Tsai; TZONG-LIN WU | ||||
341 | 0 | Common mode noise suppression circuit | Iat In Ao Ieong; Chung-Hao Tsai; Tzong-Lin Wu; TZONG-LIN WU | ||||
342 | 0 | Tzong-Lin Wu, Hao-Hsiang Chuang | TZONG-LIN WU | ||||
343 | 0 | Defected ground structure with shielding effect | Yu-Hao Hsu; Chung-Hao Tsai; Tzong-Lin Wu; TZONG-LIN WU |