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Issue DateTitleAuthor(s)SourcescopusWOSFulltext/Archive link
12014A novel noise mitigation design for TSV-to-device coupling using power distribution networkC.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems 00
22014Artificial neural network modeling for extrinsic capacitance of FinFETW.-C. Chen; C.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems 00