學術研究生涯發展計畫－桂冠型研究計畫【粉末式3D 列印之介面現象探討:液體於粉末中的流動及黏合機制】

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Project title/計畫英文名

Project Number/計畫編號

108L7725

Translated Name/計畫中文名

學術研究生涯發展計畫－桂冠型研究計畫【粉末式3D 列印之介面現象探討:液體於粉末中的流動及黏合機制】

Project Principal Investigator/計畫主持人

YING-CHIH LIAO

Funding Organization

Higher Education Sprout Project

Department/Unit

Chemical Engineering

Start date/計畫起

01-01-2019

Expected Completion/計畫迄

31-12-2019

摘要：在眾多3D列印技術中，黏著劑噴塗成型技術(Binder Jetting)是利用噴墨印表機同時噴塗多種墨水於粉末平台，層層噴印以快速印製三維物體之製程，可應用於模具快速成型、製藥及生醫產業等。但因目前少有文獻專門探討粉末式3D列印技術中，墨滴與粉體之間的流動機制與介面現象，以致於印刷產品的解析度與機械強度無法有效提升。在本計畫中，吾人將透過實際印製之成品結果與軟體模擬結合，以驗證理論進而提升產品印製品質。
Abstract: Binder jetting technology utilizes inkjet printers to print glue inks on a flat powder bed with a layer-by-layer strategy to create three-dimensional objects. The printers can create complex geometries with multiple materials on powder bed instantaneously, and are widely used in rapid prototyping, pharmaceutical tablet manufacture and biomedical device fabrication. However, the printed objects are regularly quite fragile and thus post curing processes are necessary. Moreover, the resolution after printing on the powder bed is usually worse than the original printing quality on paper. To address the printing resolution and the mechanical strength issues, one needs to acquire fundamental understanding of the microscopic capillary flow or interface phenomena between the ink and powder particles, which is difficult to observe explicitly or directly in experiments. To amend these problems, we plan to utilize computational fluid dynamics (CFD) to understand the fundamental capillary motions or drying processes of ink droplets in the powder bed, and validate the simulations with macroscopic experimental observations.

Keyword(s)

黏著劑噴塗成型技術
3D列印
介面現象
黏合機制
計算流體力學
Binder Jetting
3D Printing
Interfacial Phenomena
Adhesion
Computational Fluid Dynamics

DSpace CRIS

學術研究生涯發展計畫－桂冠型研究計畫【粉末式3D 列印之介面現象探討:液體於粉末中的流動及黏合機制】

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學術研究生涯發展計畫－桂冠型研究計畫【粉末式3D 列印之介面現象探討:液體於粉末中的流 動及黏合機制】

Details

Description

學術研究生涯發展計畫－桂冠型研究計畫【粉末式3D 列印之介面現象探討:液體於粉末中的流動及黏合機制】