Project title/計畫英文名
PUF-based軟硬整合資安晶片技術(2/2)
Project Number/計畫編號
111-2218-E-002-017-MBK
Translated Name/計畫中文名
PUF-based軟硬整合資安晶片技術(2/2)
Project Principal Investigator/計畫主持人
Funding Organization
Department/Unit
Start date/計畫起
01-05-2022
Expected Completion/計畫迄
30-04-2023