Abstract: Electronic devices for military applications have been designed to meet the most stringent specifications to sustain harsh environment. Heat dissipation has been the most important problem for military electronic devices. Conventional devices suffered from short lifetime due to over-heating under the bottleneck of developing heat dissipative materials or reducing the material cost. Hence the military expense has been immense. With the state-of-the-art material technology, the heat dissipative material could be more advanced. Most of the current military electronic devices still adopt conventional heat dissipative materials and have not been upgraded. Accordingly, this project is proposing to develop a novel heat dissipative material based on metal nitride. The developed material will be used to extend the lifetime of military electronics and hence to reduce military expense.
The interfacial thin film in the heat dissipative substrate will be investigated. Particularly, the interfacial lattice and lattice interaction will be studied. Then the heat transfer and thermal dynamics of the substrate interface will be studied. The fundamentals to design the material will be understood. The anisotropy of the heat transfer and the associated characteristics can then be effectively controlled. The diverse applications of such materials can be expected. The outcome of this project will provide an effective manner to control the heat transfer of military electronic devices. It also facilitates the understanding of the material properties and hence the future material research and development.