研究成果

第 1 到 298 筆結果，共 298 筆。

公開日期標題作者來源出版物scopusWOS全文
12024Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned FilmsTUNG-HAN CHUANG ; Chen, Yen Ting; Chen, Yin Hsuan; Chu, Chia Ching; CHAO-SUNG LIN IEEE Transactions on Components, Packaging and Manufacturing Technology
22023Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis TestsChen, Chun-Hao; Chiang, Meng Ting; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
32023Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate BiasSyafei, Devi Indrawati; Chiang, Meng Ting; TUNG-HAN CHUANG Metals0
42023Growth of Cu nanotwinned films on surface activated SiC chipsYang, Zi Hong; Chen, Yen Ting; TUNG-HAN CHUANG Journal of Materials Science: Materials in Electronics10
52023Intermetallic growth and thermal impedance at the In32.5Bi16.5Sn/Cu interfaceCHUN-HAO CHEN; Yang, Chung Lin; TUNG-HAN CHUANG Journal of Alloys and Compounds10
62023Deposition of Ag Nanotwinned Films on Graphene/ Si Photoelectrochemical Cell for CO2 Reduction and Hydrogen ProductionChen, Yen Ting; Liu, Tsung Hsin; CHUN-WEI CHEN ; TUNG-HAN CHUANG Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering
72023Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside MetallizationChiang, Meng Ting; Lee, Pei Ing; Lin, Ang Ying; TUNG-HAN CHUANG International Journal of Manufacturing, Materials, and Mechanical Engineering0
82023Low-Temperature Die Bonding of SiC Chips with DBC Ceramic Substrates Using High-Density Ag (111) Nanotwinned FilmsTUNG-HAN CHUANG ; Yang, Zi Hong; Chen, Yen Ting; Chen, Yin HsuanJournal of Materials Engineering and Performance00
92023Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned FilmsLai, Yu Chang; Yang, Zi Hong; Chen, Yin Hsuan; Chen, Yen Ting; Lin, Ang Ying; TUNG-HAN CHUANG Journal of Materials Engineering and Performance00
102022Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chipsYang, Zi Hong; Wu, Po Ching; TUNG-HAN CHUANG Scientific Reports75
112022Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packagingCHUN-HAO CHEN; TUNG-HAN CHUANG Microelectronics Reliability13
122022Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat TreatmentsChiang, Meng Ting; Chiu, Kuan Yu; Wu, Po Ching; Chang, Shih Ying; Sun, Yu Kai; TUNG-HAN CHUANG Metals11
132022Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin FilmsLee P.-I; Wu P.-C; TUNG-HAN CHUANG Journal of Electronic Materials20
142022Evaporating and Sputtering of High-Density Ag Nanotwinned Films on GaAs Compound Semiconductor WafersLee P; Chen Y; Wu P; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology00
152022Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion BombardmentLee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
162022Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic ElectrodesChen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
172022Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wireChen C.-H; Lee P.-I; TUNG-HAN CHUANG Journal of Alloys and Compounds76
182021Atomic Migration of Cu in Ti/Ni/Cu/Ag Backside Metallization on Si SubstrateLee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering00
192021Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy WiresLin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
202021Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to CopperTsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG Advances in Materials Science and Engineering
212021Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devicesWu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG Journal of Materials Science: Materials in Electronics
222021Interfacial reactions in Zn4Sb3/titanium diffusion couplesChen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
232021Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned filmsLai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG Materials Characterization
242021Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatmentsChen C.-H; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
252021Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and aluminaSun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG Applied Sciences (Switzerland)
262021Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam AssistanceWu P.-C; Chuang T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
272021Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloyChen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG Applied Sciences (Switzerland)
282021The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted depositionHsu S.-C; Hong J.-Y; Chen C.-L; Chen S.-C; Zhen J.-H; Hsieh W.-P; Chen Y.-Y; Chuang T.-H.; TUNG-HAN CHUANG Applied Surface Science
292021Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin filmsWu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG Journal of Materials Science: Materials in Electronics
302021Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate biasLai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG Materialia
312020Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip PackagingChen, C.-H.; Hsu, S.-W.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of Electronic Materials1
322020Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi 0.5 Sb 1.5 Te 3 Thermoelectric Material and a Cu ElectrodeChuang, T.-H.; Hsu, S.-W.; Lin, Y.-C.; Yeh, W.-T.; Chen, C.-H.; Lee, P.-I.; Wu, P.-C.; Cheng, H.-P.; TUNG-HAN CHUANG Journal of Electronic Materials5
332020Intermetallic Compounds at the Interfaces of Ag-Pd Alloy Stud Bumps with Al PadsChuang, T.-H.; Hsu, S.-W.; Chen, C.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology6
342020Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC PackagesChen, C.-H.; Lin, Y.-C.; Groth, A.; Lai, Y.-C.; Lin, C.-Y.; Chang, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
352020Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation processWu, Y.-J.; Hsu, S.-C.; Lin, Y.-C.; Xu, Y.; Chuang, T.-H.; Chen, S.-C.; TUNG-HAN CHUANG Surface and Coatings Technology
362020An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED PackagesChuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
372020Bondability of Pd and Au Containing Ag-Alloy Wires on Au Pads for LED PackageYuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology7
382020Lumen maintenance of ternary Ag-alloy wire bonded LED package after reliability testsYuan, J.-H.; Chuang, T.-H.; Chuang, J.-H.; TUNG-HAN CHUANG Materials Science Forum
392020p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputteringChuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG Ceramics International10
402020Deposition of (111)-oriented Ag nano-twinned film on (111) Si waferWu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering
412020Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientationsChuang, T.-H.; Wu, P.-C.; Lin, Y.-C.; TUNG-HAN CHUANG Materials Characterization
422019Atomic replacement effects on the band structure of doped perovskite thin filmsCheng, S. L.; Du, C. H.; Chuang, T. H.; TUNG-HAN CHUANG Scientific Reports55
432019Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputteringSun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG Surface and Coatings Technology
442019Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability testsYuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG Materials Science Forum
452019Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheresWen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG Thin Solid Films
462019Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressingKuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG Journal of Materials Science: Materials in Electronics
472019Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wiresKuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG Journal of Materials Science: Materials in Electronics
482018Design of diffusion barrier and buffer layers for ?]-Zn 4 Sb 3 mid-temperature thermoelectric modulesChen L.-W.; Wang C.; Liao Y.-C.; Li C.-L.; Chuang T.-H.; CHUN-HWAY HSUEH ; TUNG-HAN CHUANG Journal of Alloys and Compounds76
492018Mechanism of the Electromigration in Ag-Pd Alloy Bonding WiresChuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
502018The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni<inf>1-x</inf>O films deposited by ion beam assisted sputteringSun, H.; Chen, S.-C.; Peng, W.-C.; Wen, C.-K.; Wang, X.; Chuang, T.-H.; TUNG-HAN CHUANG Coatings
512018Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding WiresKuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
522018Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd ContentsLin, Y.-C.; Chen, C.-H.; He, Y.-Z.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
532018Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packagingChen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
542017Spin Diffusion Length in Ferromagnet/Superconductor BilayersCheng, S. L.; Chuang, T. H.; TUNG-HAN CHUANG IEEE Transactions on Magnetics00
552017p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputteringSun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG Ceramics International
562017Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording applicationOu, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG Vacuum
572017Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environmentSun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG Ceramics International
582017Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contentsChen C.-H; Lin Y.-C; Tsai C.-H; Wang S.-C; Tsai H.-H; Chuang T.-H.; TUNG-HAN CHUANG EUROCORR 2017 - The Annual Congress of the European Federation of Corrosion, 20th International Corrosion Congress and Process Safety Congress 2017
592016Low temperature bonding of Pd/Ni assembly for hydrogen purifierLin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering
602016Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu ElectrodeLin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
612016Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputteringChen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG Surface and Coatings Technology
622016Low-Temperature Bonding of Bi<inf>0.5</inf>Sb<inf>1.5</inf>Te<inf>3</inf> Thermoelectric Material with Cu Electrodes Using a Thin-Film In InterlayerLin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
632016Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced PackagesTsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
642016Microstructures and optoelectronic properties of Cu<inf>x</inf>O films deposited by high-power impulse magnetron sputteringSun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG Journal of Alloys and Compounds
652015Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayerCheng, S.; Lin, J. ; TUNG-HAN CHUANG 2015 IEEE International Magnetics Conference, INTERMAG 201500
662015Applications of Ag-Alloy stud bump for IC and LED packagesTsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
672015Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architectureChang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG Journal of Electronic Packaging, Transactions of the ASME
682015Spin injection induced phase transition in YBa<inf>2</inf>Cu<inf>3</inf>O<inf>7-δ</inf>/Nd<inf>0.35</inf>Sr<inf>0.65</inf>MnO<inf>3</inf> bilayerCheng, S.L.; Lin, J.G.; SOO-FIN CHENG ; TUNG-HAN CHUANG ; Lin, J. G. Journal of Applied Physics00
692014Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au ContentChuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
702014Nickel-tin solid-liquid inter-diffusion bondingYu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG International Journal of Precision Engineering and Manufacturing
712014Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding processChuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG Journal of Alloys and Compounds
722014Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current StressingChuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
732014Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn InterlayerChuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG Journal of Electronic Materials
742014Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wireChuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
752013Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu ElectrodeYang, C.L.; Lai, H.J.; Hwang, J.D.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance1512
762013Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayerYang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
772013Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp padsShiue, Y.Y.; Chuang, T.H.; TUNG-HAN CHUANG Canadian Metallurgical Quarterly
782013Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressingChuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
792013Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability testsChuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG IEEE Transactions on Components, Packaging and Manufacturing Technology
802013High performance Ag-Pd alloy wires for high frequency IC packagesTsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
812013Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wiresChuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
822012Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking ArchitectureChang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han IEEE Transactions on Components, Packaging and Manufacturing Technology2924
832012Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and agingChuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.; ChuangTH Materials & Design4946
842012An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packagingTsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
852012Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wireChuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Scripta Materialia
862012Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wiresChuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
872012Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBGChang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG 14th International Conference on Electronic Materials and Packaging, EMAP 2012
882011Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solderChuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH Journal of Materials Science Materials in Electronics6453
892011Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solderChang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; TUNG-HAN CHUANG Materials & Design (1980-2015)11698
902011Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd AlloyTUNG-HAN CHUANG ; Jain, Chao-ChiMetallurgical and Materials Transactions A54
912011The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce SoldersJain, C.C.; Chen, C.L.; Lai, H.J.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance85
922011Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finishLin, Hsiu-Jen; TUNG-HAN CHUANG Microelectronics Reliability1210
932011Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder JointsChuang, Tung-Han ; Wu, Hsing-FeiJournal of Electronic Materials4138
942010Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder jointsLin, Hsiu-Jen; Chuang, Tung-Han Journal of Alloys and Compounds2520
952010Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu padsShiue, Yu-Yun; Chuang, Tung-Han Journal of Alloys and Compounds4944
962010The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu padsLin, Hsiu-Jen; Chuang, Tung-Han Materials Letters98
972010Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder JointsLin, Hsiu-Jen; Chuang, Tung-Han Journal of Electronic Materials149
982009材料失效分析（材料破損分析之大陸簡體字版）莊東漢 
992009Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu PadsJain, C. C.; STEVEN SHENG-SHIH WANG ; Huang, K. W.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance55
1002009Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu padsLin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
1012009Low temperature direct electroless nickel plating on silicon waferJain, C.-C.; Wang, S.-S.; Chuang, T.-H.; Yang, S.-R.; TUNG-HAN CHUANG Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
1022009Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with ZnChuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG Journal of Electronic Materials
1032009Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packagesChuang, T.-H.; Cheng, C.-Y.; Chang, T.-C.; TUNG-HAN CHUANG Journal of Electronic Materials
1042009Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishesChuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1052009Joining 6061 aluminum alloy with Al-Si-Cu filler metalsChang, S.Y.; Tsao, L.C.; Li, T.Y.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
1062009Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finishJain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
1072009Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloyChuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG Journal of Alloys and Compounds
1082008平面顯示器概論莊東漢 ; 黃漢邦; 謝國煌 ; 蔡豐羽 ; 陳炳宏; 鄭晃忠
1092008含稀土銲錫合金表面錫鬚成長機制研究　（新制多年期第1年）莊東漢 
1102008傳統難硬銲鋁合金之真空硬銲低熔點填料金屬開發莊東漢 
1112008Low Temperature Direct Electroless Nickel Plating on Silicon WaferJain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han ; Yang, Sang-RayJournal of the Chinese Institute of Engineers
1122008Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE AlloysChuang, T.H.; Chi, C.C.; Lin, H.J.; ChuangTH Metallurgical and Materials Transactions A8
1132008Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu padsChi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1142008Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskersChuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
1152008Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending testCheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
1162008Active soldering of ZnS-SiO<inf>2</inf> sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metalChang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG Journal of Materials Processing Technology
1172008Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface FinishChuang, T.H.; Jain, C.C.; Wu, H.M.; ChuangTH Journal of Electronic Materials 
1182008Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminumLiu, C.Y.; Datta, A.; Liu, N.W.; Wu, Y.R.; Wang, H.H.; Chuang, T.H.; YUH-RENN WU ; TUNG-HAN CHUANG Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures55
1192008Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface FinishJain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han Journal of the Chinese Institute of Engineers
1202008Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple ElementsLiu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han ; Wang, Yuh-LinAdvanced Materials30
1212007材料破損分析莊東漢 
1222007Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) AlloyChuang, Tung-Han ; Lin, Hsiu-Jen; Chi, Chih-ChienJournal of Electronic Materials7
1232007Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper padsLin, W.H.; Wu, A.T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.; TUNG-HAN CHUANG Journal of Electronic Materials
1242007Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) fillerChang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG Journal of Electronic Materials
1252007Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloyChuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG Scripta Materialia
1262007Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloyChuang, T.H.; Lin, H.J.; Chi, C.C.; ChuangTH Scripta Materialia 
1272007Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder JointsChuang, Tung-Han Metallurgical and Materials Transactions A24
1282006材料破壞學莊東漢 
1292006材料分析與檢測實驗莊東漢 
1302006Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substratesWang, S.S.; Tseng, Y.H.; TUNG-HAN CHUANG Journal of Electronic Materials1414
1312006Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array packageChuang, Tung-Han ; Yen, Shiu-FangJournal of Electronic Materials 
1322006Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayerChuang, Tung-Han ; Lin, Hsiu-Jen; Tsao, Cheng-WenJournal of Electronic Materials 
1332006Mechanical properties of intermetallic compounds on lead-free solder by moiré techniquesTsai, I.; Wu, E.; Yen, S.F.; TUNG-HAN CHUANG Journal of Electronic Materials1917
1342006Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder jointsChuang, Tung-Han Scripta Materialia 
1352006Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finishChuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG Journal of Electronic Materials
1362006Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishesChuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG Journal of Electronic Materials
1372006Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu PadsLin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
1382006Intermetallic compounds formed during diffusion soldering of Au/Cu/Al <inf>2</inf>O<inf>3</inf> and Cu/Ti/Si with Sn/In interlayerChuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG Journal of Electronic Materials
1392006Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsLiu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of Electronic Materials
1402006Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder jointsChuang, T.-H.; TUNG-HAN CHUANG Scripta Materialia
1412006Abnormal growth of tin whiskers in a Sn<inf>3</inf>Ag0.5Cu0.5Ce solder ball grid array packageChuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG Journal of Electronic Materials
1422006Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishesChuang, T. H.; Yen, S. F.; Cheng, M. D.; ChuangTH Journal of Electronic Materials 
1432006Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu padsChi, Chih-Chien; Chuang, Tung-Han Journal of Electronic Materials 
1442006Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsLiu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han Journal of Electronic Materials 
1452006Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsLin, Hsiu-Jen; Chuang, Tung-Han Journal of Electronic Materials 
1462006Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finishChuang, Tung-Han ; Yen, Shiu-Fang; Wu, Hui-MinJournal of Electronic Materials 
1472005Characterization of thin films and intermetallic compounds in solder jointTsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
1482005Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu padsWu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han Journal of Electronic Materials10
1492005不同鍍層基板無鉛銲錫球格陣列構裝接點之預處理與冷熱循環試驗莊東漢 
1502004石墨、玻璃、陶瓷與金屬材料活性軟銲接合技術開發莊東漢 
1512004金屬微形元件之等溫凝固微熱壓成型研究(I)莊東漢 
1522004不同鋅含量鋁鋅合金腐蝕行為研究張世穎; 陳富謀; 莊東漢 防蝕工程
1532004Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactionsChuang, T. H.; Huang, K. W.; Lin, W. H.; ChuangTH Journal of Electronic Materials 
1542004Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu PadChiang, M.J.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1552004Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG Journal of Electronic Materials0
1562004Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substratesChuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH Journal of Electronic Materials 
1572004Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1582004陶瓷低溫活性軟銲接合之反應機理研究莊東漢 
1592004Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishesWu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han Journal of Electronic Materials6
1602004Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array PackagesCheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1612003無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一：無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(III)莊東漢 
1622003Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array PackagesChuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH Journal of Electronic Materials 
1632003起塑性Zn-22wt.%Al保金表面陽極著色處理莊東漢 ; 曹龍泉; 鄭錦榮防蝕工程
1642003無鉛銲錫在球格陣列構裝應用之挑戰莊東漢 ; 張世穎; 鄭明達; 王宣勝台大工程學刊
1652003Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloyChang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
1662003Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devicesChu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG Journal of Electronic Materials
1672003Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) fillerChang, S.Y.; Tsao, L.C.; Chiang, M.J.; Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1682003Joining alumina to Inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metalChang, S.Y.; Hung, Y.T.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1692003Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packagesChuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG Journal of Electronic Materials
1702003Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substratesLin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1712003透明導電膜濺鍍靶材的固液擴散接合技術研發莊東漢 
1722003無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫(III)莊東漢 
1732003Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al<inf>2</inf>O<inf>3</inf> with Sn interlayersLiang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1742002無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一： 無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(II)莊東漢 
1752002晶片整合電子構裝(MCM 與MCP）之可靠度試驗與破損分析(I)莊東漢 
1762002Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering ReactionsChuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; ChuangTH Journal of Electronic Materials44
1772002Intermetallic compounds formed at the interface between liquid indium and copper substratesYu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1782002Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substratesChiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1792002Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metalsTsao, L.C.; Weng, W.P.; Cheng, M.D.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1802002Soldering reactions between In49Sn and Ag thick filmsCheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
1812002Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazementsSu, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1822002Morphology and growth kinetics of Ag<inf>3</inf>Sn during soldering reaction between liquid Sn and an Ag substrateSu, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1832002Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metalsTsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG Materials Characterization
1842002Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substratesChiu, M.Y.; Chang, S.Y.; Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
1852002Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick filmsSu, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1862002Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substratesChan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
1872002IC晶片散熱器微小通道的成型與接合莊東漢 ; 陳炳輝; 曾乙修; 曹龍泉; 王宣勝; 張世穎; 張立信材料科學與工程
1882002覆晶銲錫凸塊電鍍製程模擬分析與實驗印證詹益淇; 苗志銘; 王宣勝; 莊東漢 材料科學與工程 
1892002無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫(II)莊東漢 
1902002Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrateChiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
1912002Evaluation of the formability of plastic/Zn22Al/plastic sandwiched structures by gas blowingTsao, L.C.; Su, T.L.; Chuang, T.H.; TUNG-HAN CHUANG Polymer Composites
1922001Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metalsWang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG Materials Characterization
1932001AgIn<inf>2</inf>/Ag<inf>2</inf>In transformations in an In-49Sn/Ag soldered joint under thermal agingChuang, T.H.; Huang, Y.T.; Tsao, L.C.; TUNG-HAN CHUANG Journal of Electronic Materials
1942001Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metalsTsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
1952001防電磁波干擾電子資訊產品外殼之超塑性成型加工技術研究(2/2)莊東漢 
1962001AgIn2/Ag2In transformations in an In-49Sn/Ag soldered jointChuang, T. H.; Huang, Y. T.; Tsao, L. C.; ChuangTH Journal of Electronic Materials 
1972001無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一：無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析莊東漢 
1982001無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫莊東漢 
1992000Characterization of alumina ceramics by ultrasonic testingChang, L.-S.; Chuang, T.-H.; TUNG-HAN CHUANG ; WEN-CHENG J. WEI Materials Characterization4541
2002000Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel platingYeh, M.S.; Chang, C.B.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2012000Interfacial reactions between liquid indium and silver substratesLiu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
2022000Interfacial reactions between liquid indium and Au-deposited substratesLiu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
2032000Interfacial reactions between In10Ag solders and Ag substratesLiu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
2042000Degradation of corrosion resistance for Al 5083 alloy after thermal and superplastic forming processesChang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2052000Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloyYeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2062000Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al<inf>2</inf>O<inf>3</inf> (p) compositeYeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2072000固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─總計畫莊東漢 
2082000Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solutionHuang, Her-Hsiung; Chuang, Tung-Han Materials Science and Engineering A 
2092000防電磁波干擾電子資訊產品外殼之超塑性成型加工技術研究(1/2)莊東漢 
2102000固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─子計畫一:固液擴散接合耐溫微接點界面反應研究(Ⅲ)莊東漢 
2112000Development of a low-melting-point filler metal for brazing aluminum alloysChuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.; ChuangTH Metallurgical and Materials Transactions A61
2122000Brazing of zirconia with AgCuTi and SnAgTi active filler metalsChuang, T. H.; Yeh, M. S.; Chai, Y. H.; ChuangTH Metallurgical and Materials Transactions A58
2132000Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solutionHuang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG Materials Science and Engineering A
2141999Effects of Superplastic Deformation on the Diffusion Welding of SuperDux 65 Stainless SteelYeh M.S; Tseng Y.H; TUNG-HAN CHUANG Welding Journal (Miami, Fla)7
2151999固液擴散接合法製作電子構裝耐溫微接點研究(第二年)─子計畫一：固液擴散接合耐溫微接點界面反應研究(2/3)莊東漢 
2161999Evaluation of superplastic formability for a 5083 Al-Mg alloyTseng Y.-H; TUNG-HAN CHUANG Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques3
2171999Recent research and development activities on superplasticity in TaiwanHuang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG Towards Innovation in Superplasticity Ii
2181999Progress on superplasticity and superplastic forming in Taiwan during 1987-1997Huang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG Materials Chemistry and Physics
2191999Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix compositesFang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science
2201999Applicability of ultrasonic testing for the determination of volume fraction of particulates in alumina-reinforced aluminum matrix compositesFang, C.-K.; Fang, R.L.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG Materials Characterization
2211999Erosion of SS41 steel by sand blastingFang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2221999The effect of humidity on the erosive wear of 6063 Al alloyFang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG Wear
2231999Surface morphologies and erosion rates of metallic building materials after sandblastingFang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG Wear
2241999Stress-corrosion cracking susceptibility of the superplastically formed 5083 aluminum alloy in 3.5 pct NaCl solutionChang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2251999固液擴散接合法製作電子構裝耐溫微接點研究(第二年)─總計畫莊東漢 
2261999Interfacial Reactions between Liquid Indium and Nickel SubstrateTseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Electronic Materials
2271998超塑性鋁合金大氣應力腐蝕破損機理及其音洩監測研究莊東漢 
2281998Discontinuous coarsening of discontinuous precipitates in a Co-6 at.% Mo alloyLee, S.-L.; Lee, K.-C.; Chuang, T.-H.; TUNG-HAN CHUANG Materials Science and Engineering A
2291998固液擴散接合法製作電子構裝耐溫微接點研究─總計畫莊東漢 
2301998Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al<inf>2</inf>O<inf>3</inf> and SiC substratesChai, Y.H.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG Ceramics International
2311998總計畫莊東漢 
2321998固液擴散接合法製作電子構裝耐溫微接點研究─子計畫一:固液擴散接合耐溫微接點界面反應研究莊東漢 
2331998Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloyLee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han Materials Science and Engineering A 
2341998─防電磁波干擾之金屬化塑膠粒暨其射出成型產品研製(第三年)莊東漢 
2351997─防電磁波干擾之金屬化塑膠粒暨其射出成型產品研製(2/3)莊東漢 
2361997鋁基複合材料之恆溫鍛造研究莊東漢 
2371997Effects of post-weld heat treatments on the residual stress and mechanical properties of laser beam welded SAE 4130 steel platesHuang, C.C.; Chuang, T.H.; TUNG-HAN CHUANG Materials and Manufacturing Processes
2381997Effects of post-weld heat treatments on the residual stress and mechanical properties of electron beam welded SAE 4130 steel platesHuang, C.C.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2391997Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metalsWeng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2401997Role of grain size on the stress corrosion cracking of 7475 aluminum alloysTsai T.C; TUNG-HAN CHUANG Materials Science and Engineering A13399
2411997Effects of applied pressure on the brazing of superplastic INCONEL718 superalloyYeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2421997Brazing of aluminum matrix composite with Sn <inf>10</inf> Ag <inf>4</inf> Ti active filler metalWeng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG Materials and Manufacturing Processes
2431997Influence of zr addition on the corrosion behavior of the Ni<inf>3</inf>AI intermetallic compoundsChang, T.-T.; Chuang, T.-H.; TUNG-HAN CHUANG Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
2441997Stress corrosion cracking of superplastically formed 7475 aluminum alloyTsai, T.C.; Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2451997Ultrasonic testing of artificial defects in alumina ceramicChang, Li-Shin; Chuang, Tung-Han Ceramics International
2461996台灣地區建材耐久性暨標準化研討會論文集莊東漢 台灣地區建材耐久性暨標準化研討會, 1996
2471996防電磁波干擾之金屬化塑膠粒暨其射出成型產品研製(1/3)莊東漢 
2481996英高鎳７１８超合金三明治結構件之製程方法（Ⅱ）莊東漢 
2491996Superplastic forming by decomposition of (CaCO<inf>3</inf> + C) and MgCO<inf>3</inf>Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2501996航太材料超塑性成形與擴散接合研究-第五年─航太材料超塑性成形與擴散接合研究子計畫一：「超塑性成形與擴散接合之加工製程研究」(Ⅴ)莊東漢 
2511996航太材料超塑性成形與擴散接合研究-第五年─航太材料超塑性成形與擴散接合研究(Ⅴ)(總計畫)莊東漢 
2521996Evaluation of the superplastic formability of SP-inconel 718 superalloyYeh, M.S.; Tsau, C.W.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2531996Corrosive wear of SiC whisker- and particulate-reinforced 6061 aluminum alloy compositesYu, S.Y.; Ishii, H.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2541996Diffusion bonding/superplastic forming of Ti-6Al-6V-2Sn/SUS 304 Stainless Steel/Ti-6Al-6V-2SnShyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Materials Engineering and Performance
2551996The oxidation behavior of Ni<inf>3</inf>Al-Zr alloys with various zirconium contentsChang, T.T.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Alloys and Compounds
2561996Atmospheric stress corrosion cracking of a superplastic 7475 aluminum alloyTsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2571996Technical Note: Relationship between Electrical Conductivity and Stress Corrosion Cracking Susceptibility of Al 7075 and Al 7475 AlloysTsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG Corrosion (Houston)
2581996航太材料超塑性成型與擴散接合研究總計劃(IV)莊東漢 ; 鄭榮和 ; 王文雄; 楊智富; Chuang, Tung-Han ; Cheng, Jung-Ho 
2591996鋁基複合材料接合製程與接合界面研究(Ⅱ)莊東漢 
2601996航太材料超塑性成型與擴散接合研究總計畫(第五年)莊東漢 ; 王文雄; 鄭榮合; 楊智富; 顧鈞豪; Chuang, Tung-Han 
2611996超塑性成型與擴散接合之加工製程研究(第五年)莊東漢 
2621996超塑性成型與擴散接合之有限元素分析莊東漢 
2631995超塑性成型與擴散接合之加工製程研究(第三年)莊東漢 
2641995超塑性成型與擴散接合之加工製程研究(第四年)莊東漢 
2651995─航太材料超塑性成形與擴散接合研究(IV)(總計畫)莊東漢 
2661995航太材料超塑性成形與擴散接合研究──第二期第二年(總計畫)莊東漢 
2671995鋁基複合材料接合製程與接合界面研究莊東漢 
2681995航太材料超塑性成形與擴散接合研究(IV) 子計畫一 「超塑性成形與擴散接合之加工製程研究」莊東漢 
2691995Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayerYeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG Scripta Metallurgica et Materiala
2701995建築材料耐久性標準化調查研究計畫:期末報告(六)莊東漢 
2711994Inconel 718 之超塑性成形莊東漢 ; 曹正文; Chuang, Tung-Han 超塑性成形與擴張接合學術研討會論文集 
2721994─超塑性成形與擴散接合之加工製程研究(II)莊東漢 
2731994─超塑性成形與擴散接合之加工製程研究總計畫(II)莊東漢 
2741994Grain boundary melting of hafnium containing Ni<inf>3</inf>Al intermetallic compoundsChang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG Scripta Metallurgica et Materiala
2751994紫外線對高分子複合材料機械性質之影響莊東漢 ; 曾峰柏; 顧鈞豪; Chuang, Tung-Han 中國材料科學學會民國83年年會論文集 
2761993台灣地區大氣伽凡尼腐蝕試驗莊東漢 
2771993超塑性成型與擴散接合之加工製程研究(II)莊東漢 
2781992以超音波量測陶瓷材料孔隙比之初步研究吳政忠 ; 柴駿甫; 莊東漢 ; Chuang, Tung-Han 中華民國第八屆非破壞檢測研討會論文集 
2791992On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr AlloysChuang, T. H.; Pan, Y. C.; ChuangTH Metallurgical and Materials Transactions A23 
2801992On the mechanisms of high-temperature intergranular embrittlements of Ni<inf>3</inf>Al-Zr AlloysChuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG Metallurgical Transactions A
2811992陶瓷與超合接合熱應力緩衝層設計莊東漢 
2821991鐵鋁錳合金之磨耗腐蝕研究莊東漢 
2831991Grain boundary pest of boron- doped Niin3Al at 1200 ?CChuang, T. H.; Pan, Y. C.; Hsu, S. E.; ChuangTH Metallurgical and Materials Transactions A 
2841991The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni<inf>3</inf>Al intermetallic compoundsChuang, T.H.; TUNG-HAN CHUANG Materials Science and Engineering A
2851991Grain boundary pest of boron- doped Niin3Al at 1200 °CChuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG Metallurgical Transactions A
2861991Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloysYao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG Journal of Applied Physics
2871991Long-term oxidation behaviour of Ni<inf>3</inf>Al alloys with and without chromium additionsPan, Y.C.; Chuang, T.H.; Yao, Y.D.; TUNG-HAN CHUANG Journal of Materials Science
2881990Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 KTzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG physica status solidi (a)
2891990Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloyYao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG Journal of Applied Physics
2901990Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloysYao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG physica status solidi (a)
2911989Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solutionChuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG Materials Science and Engineering A
2921989Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn AlloyYao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG IEEE Transactions on Magnetics
2931988粒子偏析-基礎科學或應用工程莊東漢 物理會刊
2941988Nontraditional grain refinement through phase transformation in an Al-Zn alloyChuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
2951988Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloyChuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG Acta Metallurgica
2961987擴散接合技術應用於人工粒界製作之研究莊東漢 國立臺灣大學工程學刊 
2971986The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloysChuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG Scripta Metallurgica
2981982Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystalsChuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lu?i?, R.; Predel, B.; TUNG-HAN CHUANG Scripta Metallurgica