第 1 到 7 筆結果,共 7 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2015 | An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces | Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; YIH-PENG CHIOU | IEEE Transactions on Antennas and Propagations | 47 | 41 | |
2 | 2014 | Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements | F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Antennas and Wireless Propagation Letters | 29 | 26 | |
3 | 2014 | An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect | C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 9 | |
4 | 2013 | ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments | C.-D. Wang; Y.-J. Chang; Y.-C. Lu; P.-S. Chen; W.-C. Lo; Y.-P. Chiou; T.-L. Wu; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 24 | 21 | |
5 | 2012 | A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Microwave and Wireless Components Letters | 41 | 37 | |
6 | 2012 | Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes | C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Microwave Theory and Techniques | 38 | 36 | |
7 | 2011 | Accuracy-improved through-silicon-via model using conformal mapping technique | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Elect. Performance Electron. Package. Systems | 6 | 0 |