第 1 到 7 筆結果,共 7 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2021 | High-Stability Quantum Dot-Converted 3-in-1 Full-Color Mini-Light-Emitting Diodes Passivated with Low-Temperature Atomic Layer Deposition | CHIEN-CHUNG LIN | IEEE Transactions on Electron Devices | |||
2 | 2021 | Colloidal quantum dot enhanced micro LEDs | Lin C.-C; Liang K.-L; Kuo W.-H; Shen H.-T; Yu P.-W; Fang Y.-H.; CHIEN-CHUNG LIN | Proceedings of the International Display Workshops | |||
3 | 2021 | An investigation on InP-based thin film photo-sensors with colloidal quantum dots | Kao S.-F; Huang Y.-M; Huang S.-K; Weng S.-Y; Kuo H.-C; CHIEN-CHUNG LIN | 2021 IEEE Photonics Conference, IPC 2021 - Proceedings | |||
4 | 2021 | A Side-Pumping Package Design for Hybrid-Quantum-Dot Light Emitting Diodes | Huang C.-P; Lee T.-Y; Yang J.-J; Shih H.-Y; Hsu S.-C; Chen T.-M; |CHIEN-CHUNG LIN | IEEE Photonics Technology Letters | |||
5 | 2021 | The Collodial Quantum Dots Light-Emitting Diodes Device Integrated with a Solder-Ball | Huang C.-P; Huang Y.-M; Yang J.-J; Kuo H.-C; Lee T.-Y; CHIEN-CHUNG LIN | 2021 IEEE Photonics Conference, IPC 2021 - Proceedings | |||
6 | 2021 | A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs | Huang C.-P; Lee T.-Y; Yang J.-J; Lin G.-T; CHIEN-CHUNG LIN | IEEE Photonics Journal | |||
7 | 2021 | An integrated platform for colloidal quantum dots and micro LEDs | Lin C.-C; Kuo H.-C.; CHIEN-CHUNG LIN | 2021 IEEE Photonics Conference, IPC 2021 - Proceedings |