Project title
微電子銲點中大規模剝離現象、其機制、及其防治手段之探討
Internal ID
98-2221-E-002-046-MY3
Principal Investigator
Start Date
August 1, 2010
End Date
July 31, 2011
Partner Organizations
微電子銲點中大規模剝離現象、其機制、及其防治手段之探討
Keywords
銲料
大規模剝離
介金屬
界面反應
solder
massive spalling
intermetallic
interfacial reaction