優勢重點領域拔尖計畫/子計畫4-三維晶片新穎高強度微奈米接點之研發

Project title

Internal ID

103R891804

Principal Investigator

Start Date

January 1, 2014

End Date

December 31, 2014

Partner Organizations

Keywords

三維積體電路

晶片對接

銲料

穿晶通孔

界面反應

Three-dimensional integrated circuit

Chip-to-chip bonding

Solder

Through silicon vias

Interfacial reaction